Layered RF Module Layout for Compact Size and Signal Isolation
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Solution Overview
Problem
Existing radio-frequency modules face challenges in reducing size while maintaining adequate isolation between electronic components, leading to potential interference and signal quality issues.
Innovation Solution
A radio-frequency module design featuring multiple substrates with electronic components and switches arranged in a layered configuration, where filters are coupled to power amplifiers via switches, improving isolation by separating components across different layers and surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are arranged in a compact layout to reduce module size, then the module size is reduced, but isolation between components deteriorates leading to signal interference
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacked arrangement of electronic components across multiple substrates. Filters, power amplifiers, and switches are distributed across different layers (first substrate, second substrate, third substrate), utilizing the vertical dimension to achieve both compact footprint and adequate isolation through spatial separation in the Z-direction.
Solution Approach 2:
The radio-frequency module is segmented into multiple independent substrates (first substrate for filters, second substrate for power amplifiers, third substrate for switches), allowing each component type to be isolated on its own layer while maintaining compact overall size through vertical stacking.
2Adaptability or versatility
If multiple filters and power amplifiers are integrated in a single module to support multiple bands, then band support capability is improved, but device complexity increases
Solution Approach 1:
The module integrates multiple filters and power amplifiers that support different frequency bands (e.g., Band 1, Band 2, Band 3, Band 4, Band 5, Band 7, Band 8, Band 12, Band 13, Band 17, Band 18, Band 19, Band 20, Band 21, Band 25, Band 26, Band 28, Band 29, Band 30, Band 31, Band 32, Band 33, Band 34, Band 35, Band 36, Band 37, Band 38, Band 39, Band 40, Band 41, Band 42, Band 43, Band 44, Band 45, Band 46, Band 47, Band 48, Band 49, Band 50, Band 51, Band 52, Band 53, Band 54, Band 55, Band 56, Band 57, Band 58, Band 59, Band 60, Band 61, Band 62, Band 63, Band 64, Band 65, Band 66, Band 67, Band 68, Band 69, Band 70, Band 71, Band 72, Band 73, Band 74, Band 75, Band 76, Band 77, Band 78, Band 79, Band 80, Band 81, Band 82, Band 83, Band 84, Band 85, Band 86, Band 87, Band 88, Band 89, Band 90, Band 91, Band 92, Band 93, Band 94, Band 95, Band 96, Band 97, Band 98, Band 99, Band 100) within a single compact module, enabling universal multi-band support while managing complexity through systematic layering and routing.
Data Source
AI summary
A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier via a switch; a second electronic component including a filter coupled to the power amplifier via the switch; and a third electronic component including the switch. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.