Layered sheet and method for molding layered sheet molded product

Solution Overview

Problem

The existing technology for molding layered sheet products faces a significant issue with coating layer floating during mold release at elevated temperatures, requiring cooling to 60° C. or lower, which prolongs the molding cycle and hinders efficient production.

Innovation Solution

A layered sheet composed of thermoplastic resin strands with a coating layer having a storage modulus of 3.00×10^6 Pa to 1.00×10^8 Pa at 150° C., allowing mold release and subsequent molding cycles to commence without cooling to 60° C., facilitated by a specific layering structure and thermocompression bonding process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If mold release is performed at elevated temperature (70-120°C), then molding cycle time is reduced, but coating layer floating occurs

Engineering Contradiction:

Improvemolding cycle timeVSAvoidcoating layer position stability

Core Design Contradiction:

Loss of timeVSManufacturing precision

Solution Approach 1:

The invention changes the physical-chemical parameters of the coating layer by specifying a storage modulus range (3.00×10^6 Pa to 1.00×10^8 Pa) at 150°C and controlling thickness (0.02 mm to 1.0 mm). These parameter changes enable the coating layer to maintain sufficient rigidity at elevated temperatures, preventing floating during mold release while allowing process temperature optimization.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention introduces dynamic temperature control in the molding process, heating the mold to 70-120°C during mold release to prevent coating layer floating through thermal activation of the adhesive layer, then cooling to 60°C or lower for subsequent cycles. This dynamic approach allows the system to adapt its thermal state to different process stages.

Inventive Principle:

Principle #15Dynamics

2Manufacturing precision

If cooling to 60°C or lower is performed before mold release, then coating layer floating is prevented, but molding cycle time increases

Engineering Contradiction:

Improvecoating layer position stabilityVSAvoidmolding cycle time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The invention introduces dynamic temperature control in the molding process, heating the mold to 70-120°C during mold release to prevent coating layer floating through thermal activation of the adhesive layer, then cooling to 60°C or lower for subsequent cycles. This dynamic approach allows the system to adapt its thermal state to different process stages.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The invention changes the physical-chemical parameters of the coating layer by specifying a storage modulus range (3.00×10^6 Pa to 1.00×10^8 Pa) at 150°C and controlling thickness (0.02 mm to 1.0 mm). These parameter changes enable the coating layer to maintain sufficient rigidity at elevated temperatures, preventing floating during mold release while allowing process temperature optimization.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If press molding is performed at 150-170°C, then molding efficiency is improved, but coating layer floating occurs during mold release

Engineering Contradiction:

Improvemolding efficiencyVSAvoidcoating layer position stability

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The invention changes the physical-chemical parameters of the coating layer by specifying a storage modulus range (3.00×10^6 Pa to 1.00×10^8 Pa) at 150°C and controlling thickness (0.02 mm to 1.0 mm). These parameter changes enable the coating layer to maintain sufficient rigidity at elevated temperatures, preventing floating during mold release while allowing process temperature optimization.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention introduces dynamic temperature control in the molding process, heating the mold to 70-120°C during mold release to prevent coating layer floating through thermal activation of the adhesive layer, then cooling to 60°C or lower for subsequent cycles. This dynamic approach allows the system to adapt its thermal state to different process stages.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient mold release and reduced molding cycle time by preventing coating layer floating, thus enhancing production efficiency and maintaining product quality.

Implementation Method 1

thermocompression-bonding the woven fabrics having the coating layer at a temperature of equal to or higher than the melting point of a thermoplastic polymer and lower than the melting point of the woven fabric

Methodology Applied

Scientific EffectThermocompression bonding:

Implementation Method 2

the mold is opened at a temperature of 70° C. to 120° C., and mold release is performed

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12109795B2Layered sheet and method for molding layered sheet molded product

Publication Date: 2024.10.08 DIATEX CO LTD

AI summary

A layered sheet product formed by layering a plurality of cloths comprised of thermoplastic resin strands and formed by layering a coating layer comprised of a thermoplastic resin onto at least one surface of the cloths, in which the thermoplastic resin is comprised of the same component as the strands and has a thickness of 0.02 mm or more and 1.0 mm or less, and a storage modulus of the coating layer at 150° C. is 3.00×106 Pa or higher and 1.00×108 Pa or lower, and a method for press molding the layered sheet and releasing the molded product after cooling to a range of 70° C. or more and 120° C. or less; and subsequently lowering the molded product temperature to 60° C. or lower.