Short-Circuit Unit Layered Design for Narrow Frame LCD

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Solution Overview

Problem

The existing short-circuit units in liquid crystal display panels occupy a large width, making it difficult to design narrow frames and can result in incomplete removal during laser processing, leading to potential damage to test equipment and residue on the array substrate.

Innovation Solution

A short-circuit unit with signal lines divided into groups and corresponding short-circuit lines disposed in different layers, reducing the overall width and facilitating complete removal by allowing for a smaller, more powerful laser beam to cover the entire unit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the short-circuit unit uses a conventional design with multiple short-circuit lines in the same layer, then the electrical connection reliability is improved, but the width of the short-circuit unit increases and the manufacturing precision deteriorates

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidremoval completeness
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies dimensionality change by moving short-circuit lines from the same layer to different layers. Specifically, the first short-circuit lines are arranged in a first layer and the second short-circuit lines are arranged in a second layer different from the first layer. This vertical arrangement reduces the planar width of the short-circuit unit while maintaining electrical connection reliability through proper layer-to-layer connectivity via conductive vias.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the diameter of the laser beam is increased to cover the entire short-circuit unit, then the removal completeness is improved, but the laser power becomes insufficient and the removal efficiency deteriorates

Engineering Contradiction:
Improveremoval completenessVSAvoidlaser power
Core Design Contradiction:
Manufacturing precisionVSPower

Solution Approach 1:

By arranging short-circuit lines in different layers, the patent reduces the planar width of the short-circuit unit. This allows a laser beam with smaller diameter and higher power density to completely cover the shortened unit width, achieving both complete removal and sufficient laser power for efficient processing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If the short-circuit unit occupies larger width, then the electrical connection coverage is improved, but the device complexity increases and the narrow frame design becomes difficult

Engineering Contradiction:
Improvesignal line grouping flexibilityVSAvoidshort-circuit unit width
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent reduces device complexity in the planar direction by arranging short-circuit lines in different layers. The first short-circuit lines in the first layer and second short-circuit lines in the second layer can serve different signal line groups, achieving versatile electrical connection coverage with a narrower overall unit width.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the short-circuit lines into different layers, with first short-circuit lines in the first layer and second short-circuit lines in the second layer. This segmentation allows independent arrangement and connection of different signal line groups, providing adaptability while reducing the planar width of the short-circuit unit.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the plane area occupied by the short-circuit unit, enabling a narrower frame design and minimizing residue on the array substrate during removal.

Implementation Method 1

the short-circuit unit will be removed from the array substrate using laser beam L

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentEP3208654B1Short-circuit unit and array substrate
Publication Date: 2019.10.23 BOE TECHNOLOGY GROUP CO LTD
  • EP3208654B1 patent drawingFigure 1~4
  • EP3208654B1 patent drawingFigure 5~8b
  • EP3208654B1 patent drawingFigure 9a~12a

AI summary

The present invention provides a short-circuit unit comprising: a plurality of signal lines divided into a plurality of groups, each group comprising multiple signal lines, and the multiple signal lines in a same group are not adjacent to each other; a plurality of short-circuit lines, each group of the signal lines correspond to one short-circuit line, and the short-circuit line electrically connects all of the signal lines in the group corresponding to the short-circuit line, the plurality of short-circuit lines are disposed in different layers and the short-circuit lines in different layers are insulated from each other. The present invention also provides an array substrate. In the short-circuit unit of the present invention, the short-circuit lines are disposed in different layers. Compared to the existing solutions in which the short-circuit lines are provided in a same layer, the width occupied by the short-circuit unit of the present invention is smaller.