Layered SIM Card Structure with Cutting Lines

Solution Overview

Problem

Conventional SIM cards face issues with size compatibility and durability, often requiring high force for separation, which can lead to damage or incompatibility with different electronic devices, necessitating adapters and risking damage to the card.

Innovation Solution

A layered structure with a Vicat softening temperature (VST) of ≥85°C, featuring cutting lines that allow for the extraction and reinsertion of differently sized portions (e.g., 2 FF, 3 FF, 4 FF SIM cards) with minimal force (≤5 N), ensuring adaptability and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional SIM cards are separated from the plastic card, then different sized SIM cards can be obtained, but the nose-pieces crack at unwanted positions and high force damages the SIM card

Engineering Contradiction:

Improvesize compatibilityVSAvoidcard integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The plastic card is segmented into multiple portions with different sizes (2 FF, 3 FF, 4 FF SIM card sizes) by introducing cutting lines. Each cutting line creates a separable section, allowing users to extract different sized SIM cards from a single card while maintaining structural integrity through controlled separation points.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cutting lines are pre-formed in the plastic card material before use. These pre-defined separation lines allow for clean, controlled extraction of SIM cards without requiring forceful breaking, thereby preventing damage to the SIM card and nose-pieces during the separation process.

Inventive Principle:

Principle #10Preliminary action

2Ease of operation

If high force is applied to separate SIM card from plastic card, then separation is achieved, but the SIM card may be destroyed or damaged

Engineering Contradiction:

Improveseparation capabilityVSAvoidcard durability

Core Design Contradiction:

Ease of operationVSStrength

Solution Approach 1:

The cutting lines are pre-formed in the plastic card material before use. These pre-defined separation lines allow for clean, controlled extraction of SIM cards without requiring forceful breaking, thereby preventing damage to the SIM card and nose-pieces during the separation process.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If the nose-piece is broken at a wrong position, then SIM cards of different sizes can be separated, but the SIM card is not fit to fit into the SIM card slot

Engineering Contradiction:

Improvesize varietyVSAvoidcutting accuracy

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The plastic card is segmented into multiple portions with different sizes (2 FF, 3 FF, 4 FF SIM card sizes) by introducing cutting lines. Each cutting line creates a separable section, allowing users to extract different sized SIM cards from a single card while maintaining structural integrity through controlled separation points.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cutting lines are pre-formed in the plastic card material before use. These pre-defined separation lines allow for clean, controlled extraction of SIM cards without requiring forceful breaking, thereby preventing damage to the SIM card and nose-pieces during the separation process.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12086666B2Layered structures with cutting lines

Publication Date: 2024.09.10 COVESTRO DEUTSCHLAND AG

AI summary

The invention is related to a layered structure with at least one layer a. of a material with a VST≥85° C. comprising at least one cutting line b. reaching through the whole thickness of the layered structure surrounding at least one first portion which is extractable and reinsertable manually from the layered structure as well as a production process for such a layered structure.