Layered Thermal Interface Pad for EMI Suppression and Electrical Isolation

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Solution Overview

Problem

Conventional thermally conductive interface materials fail to adequately electrically isolate heat sinks from electromagnetic and radio frequency interference due to their low electrical resistivity and rigidity, which diminishes thermal conductivity and can cause damage to electronic components during assembly.

Innovation Solution

A thermally conductive interface product with distinct material layers, where electromagnetic and radio frequency radiation suppression materials are confined to a specific portion, providing electrical isolation and compliance for improved thermal conductivity and component protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If homogeneous dispersions of radiation suppression substances are used in thermal interface material, then electromagnetic and radio frequency radiation suppression is improved, but electrical isolation capability deteriorates

Engineering Contradiction:

Improveelectromagnetic and radio frequency radiation suppressionVSAvoidelectrical isolation capability

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The thermal interface material is divided into distinct layers: a first layer with radiation suppression substances for EMI/RFI suppression, and a second layer without such substances for electrical isolation. This segmentation allows each layer to perform its specific function optimally without the negative effects of homogeneous mixing.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the thermal interface material are assigned different properties: the first layer contains radiation suppression substances concentrated in it for electromagnetic shielding, while the second layer maintains electrical isolation properties. This local differentiation resolves the contradiction by providing both functions in appropriate locations.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If conventional EMI suppression materials are used, then electromagnetic radiation suppression is improved, but thermal conductivity deteriorates due to rigidity

Engineering Contradiction:

Improveelectromagnetic radiation suppressionVSAvoidthermal conductivity

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent uses composite material construction with a polymeric backbone matrix containing thermally conductive filler materials (such as metal particles, oxides, nitrides, or carbides) combined with radiation suppression substances. This composite approach enables simultaneous achievement of high thermal conductivity, EMI/RFI suppression, and electrical isolation properties that single materials cannot provide.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses electromagnetic and radio frequency radiation while maintaining high thermal conductivity and softness, ensuring efficient heat transfer and protecting electronic components during assembly.

Implementation Method 1

thermally conductive interface materials are widely utilized in the electronics industry for operably coupling heat-generating electronic components to heat-sinking structures

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

manufacturers of internal electronic componentry for such devices have incorporated electromagnetic radiation-absorbing substances into thermally conductive interface materials

Methodology Applied

Scientific EffectElectromagnetic radiation absorption: Absorption (EM radiation)

Implementation Method 3

constructions have therefore been implemented in thermal interface materials which bear an operating characteristic of absorbing, reflecting, or otherwise suppressing the transmittance of electromagnetic and/or radio frequency radiation

Methodology Applied

Scientific EffectElectromagnetic reflection: Reflection

Implementation Method 4

The compliant nature of the interface product enables the product to conform to the surfaces of the electronic component and the heat sink

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS9999158B2Thermally conductive EMI suppression compositions

Publication Date: 2018.06.12 HENKEL KGAA

AI summary

An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.