Layered Thermal Interface Material for Leak-Safe Chip Cooling
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Solution Overview
Problem
Existing thermal interface materials (TIMs) face challenges such as poor reworkability, risk of silicone oil leakage, short service life, and potential for current overflow and short circuits under high temperature or high wattage conditions.
Innovation Solution
The development of thermal interface materials comprising a first and second thermal conductive adhesive layer with a thin electrically conductive functional layer in between, which includes a conductive foil with a ceramic and/or graphene heat dissipation layer, providing enhanced thermal conductivity and electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If general thermal paste or pad with average thermal conductivity K-value of 4-13 W/mK is used, then thermal conductivity efficiency is improved, but reliability deteriorates due to silicone oil leakage and short service life
Solution Approach 1:
The patent uses a composite material structure consisting of a flexible substrate layer, a phase change material layer, and a protective upper layer. This composite structure combines the thermal conductivity benefits of phase change materials with the structural stability and leakage prevention of encapsulated layers, resolving the contradiction between thermal efficiency and reliability.
Solution Approach 2:
The patent employs a flexible substrate as the base layer and uses thin film encapsulation for the phase change material. This flexible shell structure allows the TIM to conform to surface irregularities while preventing silicone oil leakage, thereby maintaining both thermal conductivity efficiency and reliability throughout the service life.
2Loss of energy
If conductive alloy paste or pad with average thermal conductivity K-value of 13-21 W/mK or 60-80 W/mK is used, then thermal conductivity efficiency is improved, but reliability deteriorates due to current overflow and short circuit under high wattage
Solution Approach 1:
The patent applies different material properties to different layers: the phase change material layer provides high thermal conductivity for heat dissipation, while the flexible substrate and protective upper layer provide electrical insulation. This local differentiation of material qualities allows the TIM to achieve both thermal efficiency and electrical safety under high wattage conditions.
Solution Approach 2:
The flexible substrate acts as an intermediary layer between the phase change material and the heatsink, providing both mechanical support and electrical insulation. This intermediary structure enables the TIM to transfer heat effectively while preventing current overflow and short circuits, resolving the contradiction between thermal efficiency and electrical reliability.
3Loss of energy
If thermal graphite is used, then thermal conductivity efficiency is improved, but ease of operation deteriorates due to inability to withstand repeated bending
Solution Approach 1:
The patent merges the high thermal conductivity of phase change materials with the flexibility of polymer-based substrates. By combining these two material types in a layered composite structure, the TIM achieves both excellent thermal conductivity efficiency and the ability to withstand repeated bending, resolving the contradiction between thermal performance and operational flexibility.
4Loss of energy
If single-layer CNT composite material is used, then thermal conductivity efficiency is improved, but device complexity increases due to multilayer or multitiered structure requirements
Solution Approach 1:
The patent segments the TIM into distinct functional layers: a flexible substrate layer for mechanical stability, a phase change material layer for thermal conductivity, and a protective upper layer for durability. This segmentation allows each layer to be optimized independently while maintaining overall simplicity in manufacturing and application, resolving the contradiction between thermal efficiency and structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution offers good reworkability, prevents silicone oil leakage, extends service life, and ensures no current overflow or short circuits under high temperature or high wattage conditions, making it suitable for various usage environments.
Implementation Method 1
thermal conductivity design requires making allowances for maximizing the contact area of the thermal conductive interface, to enable the electronic component packaging surface to highly efficiently dissipate heat generated by the electronic component
Implementation Method 2
a phase change material layer, and a protective upper layer, wherein the flexible substrate serves as a first contact interface between the electronic chip and the integrated heat spreader
Data Source
AI summary
The present invention provides thermal interface materials for the interior, center, and exterior of an electronic component, wherein the interior thereof is a first contact interface between an electronic chip and an integrated heat spreader; the center thereof is a second contact interface between the electronic chip and a heatsink; and the exterior thereof is a third contact interface between the integrated heat spreader and the heatsink. The thermal interface material consists of: a first, a second, a third thermal conductive adhesive layer, along with a thin electrically conductive functional layer. The thin electrically conductive functional layer is at least a conductive foil, a conductive foil with a ceramic and/or graphene heat dissipation layer on one side thereof, and a conductive foil with a ceramic and/or graphene heat dissipation layer on two sides thereof; and is laminated between the first and the second thermal conductive adhesive layer.