Mounting Substrate With Layered Wiring For High Density Optical Units
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Solution Overview
Problem
Current display technologies face challenges in achieving high-definition displays due to increased wiring resistances, which can be exacerbated by larger cross-sectional areas needed to reduce wiring resistances, leading to occupied space and potential impediments to high-density mounting of optical elements.
Innovation Solution
A mounting substrate with a wiring substrate that includes first and second wires, where the second wires have larger cross-sectional areas and are positioned deeper within the substrate layers, allowing for reduced wiring resistances without impeding high-density optical element mounting by alleviating surface irregularities and avoiding direct placement beneath optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cross-sectional area of wiring is increased to reduce wiring resistances, then wiring resistances are reduced, but the area occupied by wiring becomes large, which impedes high-definition display
Solution Approach 1:
The patent transitions from planar wiring arrangement to three-dimensional layered wiring structure. Second wires with larger cross-sectional areas are arranged in a layer deeper than the layer containing first wires, enabling large cross-sectional area for current carrying while keeping the mounting surface clear for high-density optical element arrangement.
2Reliability
If the cross-sectional area of wiring is increased to reduce wiring resistances, then wiring resistances are reduced, but the area occupied by wiring becomes large, which poses an impediment to achievement of high-density mounting
Solution Approach 1:
The patent utilizes vertical layering to resolve the conflict between wiring cross-sectional area and mounting density. By placing second wires with larger cross-sectional areas in a deeper layer, the mounting surface remains unobstructed, enabling high-density arrangement of optical elements while maintaining low wiring resistance through the larger cross-sectional area of second wires.
3Reliability
If second wires with larger cross-sectional areas are arranged on the mounting surface, then wiring resistances are reduced, but surface irregularities are created that limit mounting locations of optical elements
Solution Approach 1:
The patent extracts the large cross-sectional area wiring (second wires) from the mounting surface layer and places it in a deeper layer. This separation removes the source of surface irregularities from the mounting surface, allowing optical elements to be arranged freely without being constrained by wire locations, while the second wires still provide low resistance current paths in the deeper layer.
Data Source
AI summary
A mounting substrate includes: a wiring substrate; and a plurality of optical elements mounted on a mounting surface of the wiring substrate, and each having a first electrode and a second electrode. The wiring substrate includes a support substrate, a plurality of first wires, and a plurality of second wires. The first wires and the second wires are provided within a layer between the support substrate and the mounting surface. The first wires are electrically connected with the first electrodes. The second wires are electrically connected with the second electrodes, and each have cross-sectional area larger than cross-sectional area of each of the first wires.