Layered Wiring Substrate for Micro Leakage Current Measurement

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Solution Overview

Problem

Conventional current measurement devices face challenges in high precision micro leakage current measurement due to height constraints and difficulties in connecting triaxial cables and connectors, leading to leakage issues and inaccurate measurements, especially when multiple measurements are performed simultaneously.

Innovation Solution

A wiring substrate with a layered structure including insulating body, shield layers, guard layers, and semiconductor layers, which minimizes leakage current by maintaining the same potential between the central and intermediate conductor layers and using through-holes for connector connections, reducing errors and facilitating easy connection even in constrained spaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If triaxial cable and connector are connected through-hole a connector, then measurement precision is improved, but height constraints arise and connection difficulty increases

Engineering Contradiction:
Improvemicro leakage current measurement precisionVSAvoidconnector connection ease
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The invention divides the connection structure into segmented layers within the insulating body. Conductors are arranged in separate layers (first conductor layer, second conductor layer, third conductor layer) with insulating layers between them, allowing each layer to be independently connected through dedicated through-holes. This segmentation enables precise connection without height constraints while maintaining measurement precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a conventional linear connection approach to a three-dimensional layered structure. By arranging conductors in multiple layers within the insulating body and providing through-holes at different positions, the connection is achieved in the vertical dimension without requiring excessive height, thus resolving the height constraint issue while maintaining connection precision.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If multiple connectors are connected to triaxial cables simultaneously, then multiple measurements can be performed, but leakage occurs through relays and measurement accuracy deteriorates

Engineering Contradiction:
Improvesimultaneous measurement capabilityVSAvoidleakage current measurement accuracy
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The invention provides separate through-holes for each conductor layer (first through-hole for first conductor, second through-hole for second conductor, third through-hole for third conductor). This segmentation allows multiple connectors to be connected simultaneously through dedicated paths without signal interference or leakage between channels, enabling accurate simultaneous measurements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The insulating body acts as an intermediary structure between multiple connectors and the measurement system. It provides electrically isolated pathways for each conductor through dedicated through-holes, preventing leakage between multiple simultaneous measurement channels while maintaining measurement accuracy.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If connector spacing is narrow, then device compactness is improved, but connection difficulty increases

Engineering Contradiction:
Improveconnector spacingVSAvoidconnector connection ease
Core Design Contradiction:
Area of stationary objectVSEase of operation

Solution Approach 1:

The invention utilizes the vertical dimension by arranging conductors in multiple layers within the insulating body. Through-holes are provided at different vertical positions corresponding to different conductor layers, enabling connection in narrow spacing areas without requiring large horizontal distance between connectors.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The invention provides localized connection points through specifically positioned through-holes in the insulating body. Each through-hole is positioned to align with its corresponding conductor layer, enabling precise connection in narrow spaces without affecting overall device compactness.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11457526B2Wiring substrate and current measuring device
Publication Date: 2022.09.27 KK TOSHIBA
  • US11457526B2 patent drawing
  • US11457526B2 patent drawing
  • US11457526B2 patent drawing

AI summary

A wiring substrate includes an insulating body; a first conductor including a first shield layer provided in a first layer inside the insulating body, and a second shield layer provided in a second layer at a different position from the first layer in a thickness direction of the insulating body; a second conductor including a first guard layer provided in a third layer positioned between the first layer and the second layer in the thickness direction, and a second guard layer provided in a fourth layer positioned between the second layer and the third layer in the thickness direction; and a third conductor provided in a fifth layer positioned between the third layer and the fourth layer in the thickness direction.