Full-Shot Layout Correction via Density Map Segmentation
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Solution Overview
Problem
The optical proximity effect (OPE) during the exposure process of semiconductor device manufacturing leads to inefficiencies in pattern transfer, necessitating time-consuming and costly optical proximity correction (OPC) methods.
Innovation Solution
A full-shot layout correction method that includes extracting a density map, blurring it to create a blurred density map, defining correction areas, separating cell and core patterns, performing OPC on these patterns hierarchically, and reconstructing the layout to improve efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional OPC methods are applied to full-shot layouts, then optical proximity effects are corrected, but processing time and costs increase significantly
Solution Approach 1:
The patent segments the full-shot layout into multiple sub-regions based on pattern density characteristics. By dividing the large layout into smaller manageable sections, the OPC processing is performed on each sub-region separately, significantly reducing the overall processing time while maintaining correction accuracy for each segment
Solution Approach 2:
The patent applies different OPC processing strategies to different regions based on their local density characteristics. High-density regions receive different treatment compared to low-density regions, optimizing the correction process for each specific area's requirements rather than applying a uniform approach across the entire layout
2Reliability
If conventional OPC methods are applied to full-shot layouts, then optical proximity effects are corrected, but manufacturing costs increase
Solution Approach 1:
The patent segments the full-shot layout into multiple sub-regions based on pattern density characteristics. By dividing the large layout into smaller manageable sections, the OPC processing is performed on each sub-region separately, significantly reducing the overall processing time while maintaining correction accuracy for each segment
Solution Approach 2:
The patent applies different OPC processing strategies to different regions based on their local density characteristics. High-density regions receive different treatment compared to low-density regions, optimizing the correction process for each specific area's requirements rather than applying a uniform approach across the entire layout
3Productivity
If density-based correction areas are defined and patterns are separated, then processing efficiency is improved, but process complexity increases
Solution Approach 1:
The patent performs preliminary actions by extracting density maps and defining correction areas before the actual OPC processing. This preparatory step organizes the layout data into density-based groups, which simplifies the subsequent OPC processing by pre-categorizing regions that require different levels or types of correction
Solution Approach 2:
The patent introduces density maps as an intermediary representation between the original layout and the OPC processing. These density maps serve as a mediator that captures the spatial distribution of patterns, enabling the system to identify correction areas and guide the OPC process without directly manipulating the complex original layout data
Data Source
AI summary
A full-shot layout correction method includes inputting data of a full-shot layout, extracting a density map from the full-shot layout, extracting a blurred density map by blurring the density map, defining a correction area based on the blurred density map, separating a cell pattern and a core pattern, which overlap the correction area, performing an optical proximity correction (OPC) on the cell pattern, and reconstructing a full-shot layout by using the cell pattern on which the OPC has been performed.