Integrated Circuit Layout Re-decomposition for Mask Change Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electronic design tools, engineering change orders for integrated circuits often result in significant pattern mask changes, leading to fabrication delays and increased costs due to the need for reassigned components across multiple pattern masks, which are restricted by physical spacing constraints.
Innovation Solution
The method of layout re-decomposition assigns pattern colors to new layouts in a manner that maximizes color similarity with the original layout, using pattern layout correlation and color similarity metrics to minimize the number of pattern mask changes, either before or after mask creation, by applying incremental changes and reusing unused logic gates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If components are reassigned from one pattern mask to another pattern mask to overcome physical spacing constraints, then manufacturing precision is improved, but device complexity increases and loss of time occurs due to significant pattern mask changes
Solution Approach 1:
The patent applies parameter changes by modifying the decomposition parameters of the layout when a change order is received. Instead of performing a full redesign flow, the system adjusts the decomposition parameters to incorporate changes while maintaining consistency with the original pattern mask assignments, thereby reducing the number of pattern masks that need to be changed.
Solution Approach 2:
The patent performs preliminary actions by pre-decomposing the layout into pattern masks and storing the decomposition. When a change order arrives, the system leverages the existing decomposition and makes incremental adjustments rather than starting from scratch, which reduces time loss and minimizes pattern mask changes.
2Reliability
If a full application-specific integrated circuit design flow is performed to apply change orders, then reliability of changes is improved, but loss of time increases significantly
Solution Approach 1:
The patent applies partial action by performing only the necessary portion of the design flow required to implement change orders. Instead of executing the complete design flow from logic synthesis through layout extraction, the system identifies and applies only the specific changes needed to the decomposition, significantly reducing time loss while maintaining reliability of the changes.
Solution Approach 2:
The patent performs preliminary decomposition and stores it before change orders are applied. This preliminary action allows the system to quickly apply changes by modifying the existing decomposition rather than performing a full design flow, thereby reducing time loss while ensuring reliable change application through systematic processing.
3Manufacturing precision
If pattern masks are created and physically fabricated, then manufacturing precision is achieved, but loss of time and increased costs occur when significant pattern mask changes are required after fabrication
Solution Approach 1:
The patent performs preliminary decomposition and generates pattern masks with a margin for error before physical fabrication. This preliminary action allows the system to anticipate potential changes and create a flexible decomposition that can accommodate change orders with minimal pattern mask modifications, reducing fabrication delays and costs.
Solution Approach 2:
The patent applies beforehand cushioning by creating pattern masks with built-in flexibility and redundancy before fabrication. The decomposition is designed to accommodate potential change orders by maintaining options for reassignment, which cushions against the need for significant pattern mask changes after fabrication, thereby reducing time loss and costs.
4Area of stationary object
If components are placed relatively close together in multiple patterning layouts, then area utilization is improved, but device complexity increases due to multiple pattern masks
Solution Approach 1:
The patent applies parameter changes by modifying the decomposition parameters to optimize area utilization while managing the complexity of multiple pattern masks. The system adjusts parameters such as spacing thresholds and assignment criteria to achieve compact layouts without excessively increasing the number of pattern masks or their complexity.
Data Source
AI summary
Among other things, one or more techniques and systems for layout re-decomposition of a new layout corresponding to a change order to an original layout associated with an integrated circuit are provided. The change order is applied to the original layout to create the new layout. The original layout comprises one or more original pattern portions assigned pattern colors that correspond to pattern masks. One or more new pattern portions within the new layout are assigned pattern colors such that the new layout has a relatively high color similarity with respect to the original layout. In this way, changes to the pattern masks are reduced, thus mitigating fabrication delay or costs that would otherwise result from significant changes to the pattern masks.