Semiconductor Layout Repair Using Slotted Power Fill Grids

Solution Overview

Problem

The increasing integration of semiconductor devices leads to higher resistance values in conductive wires and voltage drop effects, slowing switching speeds and increasing power consumption, affecting performance and reliability.

Innovation Solution

A method and apparatus for repairing semiconductor layouts by forming a power fill grid with slotted holes that overlap metal connection lines, increasing the area of staggered sections to reduce resistance and form equivalent capacitors, thereby improving electron mobility and reducing voltage drops.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the width of conductive wire is reduced to increase integration degree, then the integration degree is improved, but the resistance value increases and voltage drop effect becomes more obvious

Engineering Contradiction:

Improveintegration degreeVSAvoidvoltage drop effect

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The conductive wire is segmented into multiple parallel conductive wires, where each wire carries a portion of the total current. This segmentation reduces the resistance of each individual wire while maintaining the overall compact layout, thereby reducing voltage drop without sacrificing integration density

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple parallel conductive wires are merged to form a composite conductive structure that functions as a single low-resistance pathway. By combining multiple thin wires in parallel, the overall resistance is reduced while maintaining the space-efficient design required for high integration

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If the width of conductive wire is reduced to increase integration degree, then the integration degree is improved, but the switching speed slows down

Engineering Contradiction:

Improveintegration degreeVSAvoidswitching speed

Core Design Contradiction:

Adaptability or versatilityVSSpeed

Solution Approach 1:

The conductive wire is segmented into multiple parallel conductive wires, where each wire carries a portion of the total current. This segmentation reduces the resistance of each individual wire while maintaining the overall compact layout, thereby reducing voltage drop without sacrificing integration density

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple parallel conductive wires are merged to form a composite conductive structure that functions as a single low-resistance pathway. By combining multiple thin wires in parallel, the overall resistance is reduced while maintaining the space-efficient design required for high integration

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If the width of conductive wire is reduced to increase integration degree, then the integration degree is improved, but the power consumption increases

Engineering Contradiction:

Improveintegration degreeVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The conductive wire is segmented into multiple parallel conductive wires, where each wire carries a portion of the total current. This segmentation reduces the resistance of each individual wire while maintaining the overall compact layout, thereby reducing voltage drop without sacrificing integration density

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple parallel conductive wires are merged to form a composite conductive structure that functions as a single low-resistance pathway. By combining multiple thin wires in parallel, the overall resistance is reduced while maintaining the space-efficient design required for high integration

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces resistance and power consumption, enhances semiconductor device performance, and ensures reliable manufacturing by avoiding physical verification errors.

Implementation Method 1

Because the power filled grid at least partially overlaps the metal connection line on the initial layout, an equivalent capacitor is formed in an overlapping region, which increases electrons stored in the power fill grid and improves mobility of the electrons on the power fill grid

Methodology Applied

Scientific EffectCapacitance: Capacitance

Data Source

PatentUS12423497B2Layout repairing method and apparatus, computer device, and storage medium

Publication Date: 2025.09.23 CHANGXIN MEMORY TECH INC

AI summary

The present disclosure relates to a layout repairing method and apparatus, a computer device, and a storage medium. The method includes: obtaining an initial layout of a semiconductor integrated circuit, wherein a metal connection line is formed on the initial layout; forming a power fill grid on the initial layout, wherein the power fill grid includes a slotted hole that overlaps orthographic projection of the metal connection line on the power fill grid, and the slotted hole includes a first section overlapping the metal connection line and at least one second section staggered with the metal connection line; and increasing area of the second section if the area of the second section is less than a lower threshold, to form a repaired layout.