Liquid Crystal Aligning Film Patterning for Roll-to-Roll Processing

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Solution Overview

Problem

The existing methods for manufacturing liquid crystal aligning films face challenges such as inefficiency, high costs, and environmental concerns due to the use of organic solvents in the wet etching process, which hinders the roll-to-roll continuous process and affects the adhesion and durability of the films, especially in high-temperature and high-humidity environments.

Innovation Solution

A method involving a multilayer structure with a substrate, conductive layer, liquid crystal alignment layer, and passivation film, where pulse laser irradiation is used to etch the liquid crystal alignment layer and remove the passivation film, minimizing damage to the conductive layer and eliminating the need for organic solvents, thus enabling a roll-to-roll continuous process while enhancing adhesion and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If wet etching with organic solvents is used to remove the liquid crystal alignment layer, then the alignment layer can be selectively removed, but the process efficiency decreases and environmental problems arise

Engineering Contradiction:
Improveselective removal of alignment layerVSAvoidprocess efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the chemical wet etching process with a photolithography-based patterning process. Specifically, a photoresist layer is applied, exposed through a mask to define the desired pattern, and developed to selectively remove the alignment layer only in required areas. This substitution of chemical etching with photochemical patterning eliminates organic solvent usage while maintaining selective removal capability and improving process efficiency through standard semiconductor manufacturing techniques.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the processing parameters by using photolithography with controlled exposure wavelengths and development conditions instead of chemical etchants. By adjusting photoresist thickness, exposure energy, and development time, precise control over alignment layer removal is achieved without the environmental and efficiency drawbacks of wet etching.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If photolithography is used to form the liquid crystal alignment layer, then the alignment layer can be precisely patterned, but the manufacturing cost increases and compatibility with roll-to-roll process decreases

Engineering Contradiction:
Improvealignment layer patterning precisionVSAvoidmanufacturing cost and process compatibility
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies the alignment layer material across the entire substrate before patterning, rather than attempting to deposit material only in required areas. This preliminary full coverage approach allows subsequent photolithography to simply define the pattern by removing excess material, simplifying the process and improving compatibility with roll-to-roll manufacturing where continuous coating is more feasible than selective deposition.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent extracts only the necessary portions of the alignment layer through photolithographic patterning after full deposition. This approach separates the coating step (which can be done continuously in roll-to-roll) from the patterning step (which defines the final pattern), making the overall process more compatible with continuous manufacturing while maintaining precision.

Inventive Principle:
Principle #2Taking out (Extraction)

3Strength

If the liquid crystal alignment layer is removed to expose the conductive layer, then adhesion with sealant improves, but additional processing steps are required

Engineering Contradiction:
Improveadhesion with sealantVSAvoidnumber of processing steps
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent combines the alignment layer patterning and sealant application areas into a single photolithography step. By designing the mask to expose both the regions where alignment layer removal is needed for sealant adhesion and the regions where liquid crystal will be filled, the process achieves multiple objectives in one operation, reducing total processing steps while maintaining excellent sealant adhesion.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the production of liquid crystal aligning films that are environmentally friendly, economically viable, and compatible with continuous processing, with improved adhesion and moisture/bubble blocking characteristics, maximizing the durability of the films in varying environmental conditions.

Implementation Method 1

etching one area of the liquid crystal alignment layer by irradiating a pulse laser to the multilayer structure

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

irradiating a pulse laser to the multilayer structure

Methodology Applied
Scientific EffectLaser: Laser

Data Source

PatentUS11428992B2Method for manufacturing liquid crystal aligning film
Publication Date: 2022.08.30 LG CHEM LTD
  • US11428992B2 patent drawing
  • US11428992B2 patent drawing
  • US11428992B2 patent drawing

AI summary

A method for manufacturing a liquid crystal aligning film includes preparing a multilayer structure in which a substrate, a conductive layer, a liquid crystal alignment layer, and a passivation film are sequentially provided, etching one area of the liquid crystal alignment layer by irradiating a pulse laser to the multilayer structure, and exposing one area of the conductive layer by removing the passivation film, wherein the pulse laser is irradiated to the liquid crystal alignment layer from the passivation film. The method is compatible with a continuous process.