LC Composite Device Segmentation for High Inductance
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Solution Overview
Problem
Existing power supply devices face challenges in miniaturizing inductors and capacitors due to difficulties in forming magnetic body films with high magnetic permeability, making it hard to achieve predetermined high inductance in small-sized devices.
Innovation Solution
The LC composite device integrates a thin film inductance element on a glass substrate with a magnetic body portion, using a sintered ferrite substrate to enhance magnetic permeability, and a thin film capacitance element on a semiconductor substrate, allowing for independent formation and stacking of each component to achieve higher inductance while maintaining a small size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thin film process is used to form a magnetic body film on a base material, then the device size is reduced, but the magnetic permeability and inductance are insufficient
Solution Approach 1:
The device is divided into separate substrate and magnetic body portions that are independently formed and then integrated through stacking. This allows the magnetic body to be formed with high magnetic permeability material separately from the thin film substrate, resolving the contradiction between small size and high magnetic permeability.
Solution Approach 2:
The invention uses composite construction by combining a thin film substrate with a magnetic body formed from high magnetic permeability material. This composite structure achieves both the miniaturization benefits of thin film technology and the high inductance requirements of power supply circuits.
2Reliability
If the coil size is increased to achieve high inductance, then the inductance requirement is met, but the device size increases
Solution Approach 1:
The invention changes the magnetic permeability parameter by using high magnetic permeability material for the magnetic body, rather than relying on increasing coil size. This allows high inductance to be achieved in a compact form factor by fundamentally changing the magnetic properties of the structure.
3Ease of manufacture
If existing thin film processes are used, then the manufacturing process is simple, but high magnetic permeability cannot be achieved
Solution Approach 1:
The manufacturing process is segmented into independent steps for forming the substrate portion and the magnetic body portion, which are then integrated through stacking. This segmentation allows each portion to be optimized separately while maintaining manufacturing simplicity through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of a small-sized processor with a switching power supply circuit that achieves higher inductance and optimal electrical characteristics, overcoming the limitations of traditional thin film processes.
Implementation Method 1
using a sintered ferrite substrate to enhance magnetic permeability
Data Source
AI summary
An LC composite device includes a capacitor portion, an inductor portion, and a magnetic body portion. The capacitor portion is configured of a first substrate and a thin film capacitance element formed on the first substrate through a thin film process. The inductor portion is configured of a second substrate and a thin film inductance element formed on the second substrate through a thin film process. The magnetic body portion includes a magnetic substrate, and the capacitor portion. The inductor portion and the magnetic body portion are stacked in a positional relationship in which the magnetic body portion and the inductor portion are in contact with each other.