Multilayer LC Composite Layout for Low-Interference Miniaturization
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Solution Overview
Problem
In high-frequency circuit applications, LC composite components face challenges in miniaturization due to interference between coil and capacitor conductor patterns, which affects phase-to-frequency characteristics and impedance matching in communication terminal devices.
Innovation Solution
The LC composite component design includes a multilayer body with insulating base members, where the coil conductor pattern features linear and bent portions, and the capacitor conductor pattern is positioned on different base members with extending and projecting portions that overlap with the coil pattern without interfering with its bent portions, reducing magnetic flux hindrance and parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the area of the capacitor conductor pattern is increased to achieve the required capacitance, then the capacitance value is improved, but the capacitor conductor pattern interferes with magnetic fluxes of the transformer, worsening the interference between coil and capacitor patterns
Solution Approach 1:
The capacitor conductor pattern is configured to extend in the lamination direction (vertical dimension) rather than only in the planar direction. By having the capacitor pattern extend across multiple insulating base members in the lamination direction, the required capacitance is achieved without increasing the planar area, thereby avoiding interference with magnetic fluxes in the horizontal plane.
Solution Approach 2:
The capacitor conductor pattern is positioned specifically on insulating base members different from those carrying the coil conductor pattern. This spatial separation in the lamination direction creates local isolation between the capacitor and coil patterns, reducing electromagnetic interference while maintaining the required capacitance value.
2Object-generated harmful factors
If a gap is increased between the transformer and capacitor conductor pattern to reduce interference, then the interference is reduced, but the chip size increases, worsening the miniaturization goal
Solution Approach 1:
Instead of increasing the horizontal gap between transformer and capacitor patterns, the solution moves the separation to the vertical dimension (lamination direction). The capacitor conductor pattern is placed on different insulating base members stacked vertically, achieving interference reduction without increasing the chip's planar footprint.
Solution Approach 2:
The capacitor and transformer are nested in the vertical dimension by placing them on different insulating base members that are laminated together. This nested arrangement allows both components to coexist in a compact vertical stack, reducing horizontal interference while maintaining small chip size.
3Object-generated harmful factors
If the capacitor conductor pattern is shaped to conform to coil shape with notches to reduce interference, then the interference is reduced, but narrow line width current paths are generated, increasing ESL and worsening phase-to-frequency characteristics
Solution Approach 1:
The capacitor conductor pattern extends in the lamination direction across multiple insulating base members rather than conforming to coil shapes in the horizontal plane. This vertical extension provides sufficient current path width without requiring narrow notched features, maintaining low ESL and good phase-to-frequency characteristics.
Solution Approach 2:
The capacitor conductor pattern uses sufficient line width and area to maintain low equivalent series inductance (ESL). By changing the geometric parameters of the capacitor pattern to extend vertically rather than horizontally, the design achieves both low interference and low ESL, preserving phase-to-frequency characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves miniaturization while minimizing interference between coil and capacitor patterns, maintaining phase-to-frequency characteristics and enabling effective impedance matching across multiple frequency bands.
Implementation Method 1
a first coil conductor pattern defining a first coil L1 connected between a first terminal T1 and a ground terminal GND, a second coil conductor pattern defining a second coil L2 connected between a second terminal T2 and the ground terminal GND and providing magnetic field coupling with the first coil L1
Implementation Method 2
a capacitor conductor pattern configuring a capacitor C connected between the first terminal T1 and the second terminal T2
Data Source
AI summary
An LC composite component includes a multilayer body including insulating base members that are laminated and include insulating base members on which conductor patterns are provided. Capacitor conductor patterns are provided on insulating base members different from an insulating base member on which a coil conductor pattern is provided, and each include an extending portion overlapping with a line segment connecting a center of a first terminal and a center of a second terminal in a shortest distance as viewed in the lamination direction and projecting portions projecting in directions different from the direction of the line segment, and the projecting portions overlap with linear portions of the coil conductor pattern without overlapping with bent portions thereof as viewed in the lamination direction.