LC Composite Component with Segmented Substrates for High Q and Capacitance
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Solution Overview
Problem
Existing LC composite electronic components face challenges in forming inductors with high Q values and capacitors with large capacitance due to limitations in thin-film processes, and they suffer from low adhesion strength between ceramic substrates and external terminals, leading to reliability issues and potential electrochemical migration.
Innovation Solution
The solution involves a ceramic substrate with a magnetic layer and a thin-film insulator layer containing a capacitor element and a coil-shaped inductor element, where the external terminals are formed on the thin-film insulator layer, allowing for larger film thicknesses and improved adhesion, reducing direct-current resistance and parasitic inductance, and using a barium strontium titanate sintered body for the dielectric body to enhance magnetic isolation and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a capacitor is formed using a thin film process, then it is easy to form a capacitor having a large capacitance, but it is difficult to form an inductor having a high Q value
Solution Approach 1:
The invention divides the component into two separate substrates: a first substrate for forming the inductor and a second substrate for forming the capacitor. This segmentation allows each component to be optimized independently - the inductor can use thick film processes for high Q value while the capacitor can use thin film processes for large capacitance, resolving the contradiction between the two requirements.
Solution Approach 2:
The invention embeds one substrate within another by forming a groove in the first substrate and inserting the second substrate into it. This nesting structure allows both the inductor and capacitor to coexist in a compact arrangement while maintaining their respective optimized structures - the inductor on the first substrate and the capacitor on the second substrate, thereby achieving both high Q value and large capacitance.
2Ease of operation
If external terminals are formed on the surface of the ceramic substrate, then connections to the outside are realized, but adhesion strength between the ceramic substrate and external terminals is low
Solution Approach 1:
The invention introduces a plating layer as an intermediary between the external terminals and the first substrate. This plating layer serves as a mediator that enhances adhesion strength while maintaining electrical connectivity, resolving the contradiction between achieving external connections and ensuring strong bonding. The plating layer acts as a transition zone that improves the bond between the terminal material and the substrate.
3Quantity of substance
If the distance between capacitor electrodes is made small, then large capacitance is achieved, but the film thicknesses of inductor conductor patterns cannot be made large
Solution Approach 1:
By segmenting the device into two separate substrates - one dedicated to the inductor and another to the capacitor - the invention allows each component to have its own optimized dimensions. The capacitor can achieve small electrode spacing for large capacitance on its substrate, while the inductor can have thick conductor patterns on its substrate, eliminating the dimensional conflict that would exist in a single-substrate design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the formation of LC composite electronic components with high-frequency characteristics, reliable connections, and reduced risk of electrochemical migration and short circuits, while maintaining the integrity of the inductor's Q value and capacitor's capacitance.
Implementation Method 1
a thin-film dielectric body; a capacitor element that is formed in the thin-film insulator layer
Implementation Method 2
using a barium strontium titanate sintered body for the dielectric body to enhance magnetic isolation and moisture resistance
Data Source
AI summary
An LC composite electronic component includes a ceramic substrate that includes a magnetic layer, a thin-film insulator layer that is formed using a thin film process on a surface of the ceramic substrate, a coil-shaped inductor element that is formed in the ceramic substrate, a capacitor element that is formed in the thin-film insulator layer, and external terminals that are formed on a surface of the thin-film insulator layer. The capacitor element is located in the thin-film insulator layer and includes a first capacitor electrode, a second capacitor electrode and a thin-film dielectric body at least part of which is arranged between the first and second capacitor electrodes. The external terminals are each respectively connected to at least one out of the inductor element and the capacitor element.