LC Device Magnetic Circuit for Q Value
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Solution Overview
Problem
Existing LC devices with integrally formed inductors and capacitors face issues such as increased direct-current resistance and reduced Q value due to magnetic field interference, making them unsuitable for large current applications and prone to inductor loss.
Innovation Solution
The LC device incorporates a loop-shaped conductor pattern with a magnetic-body structure that suppresses magnetic field losses by using multiple magnetic bodies to form a closed magnetic circuit, improving DC superimposition characteristics and reducing parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thin-film process is used to form an inductor and capacitor, then the inductor and capacitor can be integrally formed in a single element, but the direct-current resistance of the inductor is increased and the Q value is reduced
Solution Approach 1:
The patent uses a composite structure combining a conductor pattern (copper or aluminum) with a magnetic body (ferrite or permalloy) to form the inductor. This composite structure allows the inductor to achieve low DC resistance through the conductor while the magnetic body provides high permeability to enhance inductance and Q value, resolving the contradiction between ease of manufacture and reliability
2Ease of manufacture
If the capacitor is disposed in an opening of the spiral-shaped inductor and covered by an insulating resin, then the inductor and capacitor are integrally formed, but the magnetic field generated by the inductor acts on the capacitor causing inductor loss and reduced Q value
Solution Approach 1:
The patent extracts the capacitor from the interior of the inductor loop and places it on the outer periphery of the inductor. This spatial separation removes the capacitor from the region where the magnetic field is strongest, preventing magnetic field interference and reducing inductor loss while maintaining integral formation through common packaging
3Device complexity
If the magnetic field generated by the inductor acts on the capacitor, then the inductor and capacitor are closely integrated, but this results in inductor loss and reduced Q value
Solution Approach 1:
The patent segments the inductor structure into an inner loop portion and an outer loop portion, with the capacitor placed on the outer periphery. The magnetic body is positioned to surround the inner loop portion, creating distinct functional zones that separate the magnetic field confinement area from the capacitor location, thereby maintaining integration while reducing magnetic interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the Q value of the inductor, reduces losses, and improves the device's suitability for large current applications by effectively managing magnetic field interactions.
Implementation Method 1
The first magnetic-body forms part of the element and is disposed between the loop-shaped conductor pattern and the mounting-type capacitor over substantially an entire length of the loop-shaped conductor pattern
Implementation Method 2
the magnetic field that is generated by the loop-shaped conductor pattern passes through the first magnetic-body portion to suppress capacitor loss
Implementation Method 3
The inductor includes a loop-shaped conductor pattern disposed inside the element and in plan view from the first principal surface
Data Source
AI summary
An inductor having an excellent Q values is provided with a configuration in which an inductor and a capacitor are integrally formed in a single element. Specifically, an LC device is provided that includes an element, an inductor, a capacitor, and a magnetic body portion. The element has a planar shape, and includes an insulating resin layer at at least part of the element. The inductor includes a loop-shaped conductor pattern and is formed inside the element. The capacitor is a mounting-type element, and is disposed in an opening of the loop-shaped conductor pattern and inside the element with at least a mounting surface of the capacitor being in contact with the resin layer. The magnetic body portion forms part of the element and is disposed between the conductor pattern and the capacitor over substantially an entire length of the loop-shaped conductor pattern.


