Liquid Crystal Device Substrate Cleaving via Protection Film

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Solution Overview

Problem

The existing methods for manufacturing liquid crystal devices face challenges in accurately cleaving glass substrates due to large variations in groove depth caused by varying scribing pressures, leading to difficulties in substrate division and precise formation of liquid crystal devices.

Innovation Solution

A method involving the use of a protection film to absorb pressure variations during scribing, allowing for the formation of grooves with reduced depth variation, which enables accurate cleavage of substrates and precise division into liquid crystal devices, while also ensuring easy removal of adhesive films without damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the pressure of the scribing wheel is lowered to form grooves, then the groove depth can be controlled, but large variation in groove depth occurs

Engineering Contradiction:
Improvegroove depth uniformityVSAvoidcleaving accuracy
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

A protection film is introduced as an intermediary layer between the scribing wheel and the glass substrate. The film absorbs pressure variations during scribing, converting mechanical instability into a controlled intermediate process. This mediator ensures uniform groove depth by cushioning the effect of pressure fluctuations while allowing consistent cutting depth through the film thickness.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The protection film is applied to the glass substrate before scribing begins. This beforehand cushioning prepares the substrate by providing a pressure-absorbing layer that prevents direct transmission of pressure variations to the glass. The film acts as a buffer that stabilizes the scribing process from the outset, ensuring uniform groove formation.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Ease of manufacture

If the pressure of the scribing wheel is raised to form grooves, then cleaving can be performed, but large variation in groove depth occurs

Engineering Contradiction:
Improvesubstrate divisionVSAvoidgroove depth uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The protection film serves as a mediator that allows high pressure to be applied during scribing while preventing direct transmission of pressure variations to the glass substrate. This enables easy substrate division through effective grooving while maintaining precision through the film's pressure-absorbing property.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The protection film converts the harmful effect of pressure variations into a beneficial stabilization mechanism. What would normally cause uneven grooves is transformed into a controlled process where the film's thickness provides uniform pressure distribution, turning potential defects into a precision-forming advantage.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Productivity

If grooves are formed without protection film, then scribing can be performed directly, but adhesive film damage occurs during removal

Engineering Contradiction:
Improvefabrication efficiencyVSAvoidadhesive film damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The protection film is applied before scribing to cushion and protect the adhesive film from direct contact with the scribing wheel. This beforehand protection prevents adhesive film damage during the scribing process and subsequent removal operations, while the film's presence is accounted for in the fabrication timeline.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The protection film acts as an intermediary barrier between the scribing wheel and the adhesive film. This mediator prevents direct mechanical contact that would cause adhesive film damage, while the film's temporary nature allows it to be removed after serving its protective function during fabrication.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11175540B2Liquid crystal device manufacturing method and liquid crystal device
Publication Date: 2021.11.16 JVC KENWOOD CORP
  • US11175540B2 patent drawing
  • US11175540B2 patent drawing
  • US11175540B2 patent drawing

AI summary

Provided is a liquid crystal device manufacturing method capable of accurately cleaving a substrate when it is cleaved from grooves formed therein by reducing the variation in depth of the grooves. A structure is fabricated. Drive substrates having terminal portions are formed by dividing a first substrate. A protection film is attached to a second substrate side of the structure. Grooves are formed in the second substrate near the terminal portions through the protection film. Counter substrates are formed by cleaving the second substrate from the grooves, the end surface of each counter substrate on the terminal portion side including a cleaved surface. Liquid crystal devices are fabricated in each of which a drive substrate and a counter substrate are bonded to each other by a seal, and a liquid crystal is filled in a gap between the drive substrate and the counter substrate and sealed by the seal.