Liquid Crystal Device Manufacturing Apparatus Cell Gap Control
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Solution Overview
Problem
The batch bonding method for liquid crystal devices is prone to producing defective products due to defective regions on semiconductor substrates, while the substrate-cutting method struggles with maintaining parallel alignment, leading to large in-plane variations in cell gaps and performance degradation.
Innovation Solution
A manufacturing apparatus and method that involves a chamber with a stage and substrate holding unit for precise alignment and bonding of substrates, using a transparent weight substrate to adjust the cell gap and improve in-plane distribution, and ultraviolet curing of sealing material to bond substrates efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If batch bonding method is used to manufacture liquid crystal devices, then productivity is improved by manufacturing multiple devices simultaneously, but reliability deteriorates due to defective regions on semiconductor substrates producing defective products
Solution Approach 1:
The patent divides the manufacturing process into two stages: first cutting semiconductor substrates into individual drive substrates and selecting only good ones, then bonding these selected substrates with counter substrates. This segmentation allows quality control at the substrate level while maintaining batch processing efficiency in the bonding stage.
Solution Approach 2:
The patent performs substrate cutting and quality selection before the bonding process. By preliminarily identifying and selecting good drive substrates from cut pieces, the system prevents defective substrates from entering the bonding process, thereby ensuring product reliability while maintaining efficient batch manufacturing.
2Reliability
If substrates are cut into pieces and bonded in units of liquid crystal devices, then reliability is improved by selecting good drive substrates, but manufacturing precision deteriorates due to difficulty in maintaining parallel alignment leading to large in-plane variation in cell gap
Solution Approach 1:
The patent introduces a cell gap control layer with specific thickness between the drive substrate and counter substrate. By controlling the thickness parameter of this layer, the system maintains uniform cell gap across the bonded substrates, resolving the alignment precision issue while preserving the ability to select good substrates.
Solution Approach 2:
The patent uses a cell gap control layer as an intermediary element between the drive substrate and counter substrate. This intermediary layer facilitates precise parallel alignment and maintains uniform cell gap, enabling both high reliability through substrate selection and high manufacturing precision through controlled spacing.
3Adaptability or versatility
If drive substrate and counter substrate are bonded after cutting, then adaptability is improved by allowing selection of good substrates, but device complexity increases due to difficulty in effective bonding and parallel alignment
Solution Approach 1:
The patent employs a stage and substrate holding plate structure that can handle multiple substrates simultaneously with standardized positioning. This universal structure simplifies the bonding process by providing consistent alignment mechanisms for all substrate pairs, reducing process complexity while maintaining the flexibility to select and bond individual good substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the simultaneous manufacture of multiple liquid crystal devices with targeted cell gaps and improved in-plane distribution, reducing performance degradation and enhancing the reliability of the liquid crystal devices.
Implementation Method 1
moving the stage toward the substrate holding plate so that the first substrates and the second substrates come into contact with each other via the sealing material and the liquid crystal
Implementation Method 2
pushing upward the second substrates by the stage so that the second substrates are separated from the substrate holding plate so as to act a gravity of the third substrate on the second substrates
Implementation Method 3
irradiating light to a predetermined area of the first substrates to bond the first substrates and the second substrates
Implementation Method 4
after decompressing an inside of the chamber
Data Source
AI summary
A manufacturing apparatus of a liquid crystal device includes a chamber, a stage, a plate holding unit, a driver, and a controller. The stage is housed inside the chamber and holds a plurality of first substrates. The plate holding unit is housed inside the chamber and holds a plurality of second substrates. The driver drives the stage or the plate holding unit. In a state in which a third substrate is held on the plurality of the second substrates, or in a state in which the third substrate and one of a light shielding mask and a light reduction mask are held on the plurality of the second substrates, the controller controls the driver to manufacture a plurality of the liquid crystal devices by bonding together the plurality of the first substrates and the plurality of the second substrates.