LC Resonator Columnar Conductor Pattern Design
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Solution Overview
Problem
The reduction in profile of LC resonators with multiple dielectric layers leads to increased current density in inductors, resulting in higher insertion loss and lower Q values due to shorter via conductor patterns and a higher ratio of line conductor pattern length to loop length.
Innovation Solution
Incorporating columnar conductor patterns with a greater cross-sectional area than via conductor patterns, which reduces current density and prevents the increase in insertion loss, thereby maintaining or improving the Q value of the LC resonator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the profile of the LC resonator is lowered in the laminated direction, then the device size is reduced, but the via conductor patterns become shorter which increases current density and insertion loss, thereby reducing the Q value
Solution Approach 1:
The patent transitions from conventional via conductor patterns (extending vertically through dielectric layers) to columnar conductor patterns that extend horizontally along the lateral dimensions. This dimensional change allows the current path to maintain sufficient length and cross-sectional area even when the vertical profile is reduced, thereby maintaining low current density and high Q value while achieving a lower device profile.
Solution Approach 2:
The patent changes the orientation and dimensional parameters of the conductor patterns. Instead of vertical via patterns with small cross-sectional areas, the invention uses columnar patterns with larger cross-sectional areas extending in lateral directions. This parameter change in conductor geometry maintains current density at acceptable levels even when the overall device thickness is reduced.
2Length of moving object
If the via conductor patterns are shortened to reduce profile, then the device becomes more compact, but the ratio of line conductor pattern length to loop length increases, increasing current density and insertion loss
Solution Approach 1:
The patent redistributes the conductor pattern geometry from vertical to lateral dimensions. The columnar conductor patterns extend horizontally along the loop path rather than vertically through dielectric layers. This dimensional redistribution maintains sufficient conductor length for low resistance while achieving compact vertical profile, thereby reducing insertion loss.
3Area of stationary object
If the cross-sectional area of conductor patterns is small as in conventional via patterns, then the structure is compact, but the current density increases leading to higher insertion loss
Solution Approach 1:
The patent fundamentally changes the geometric parameters of the conductor patterns by transitioning from small cross-sectional area via patterns to large cross-sectional area columnar patterns. This parameter change in conductor geometry directly reduces current density (J = I/A) while maintaining compact overall device dimensions through lateral extension rather than vertical thickness.
Data Source
AI summary
An LC resonator includes an external connection terminal, an inductor, a capacitor, and a via conductor pattern. The inductor winds around an axis orthogonal to a laminated direction. The capacitor is connected to the inductor. The via conductor pattern extends from the inductor in the laminated direction, and the inductor is connected to the external connection terminal with the via conductor pattern. The inductor includes a columnar conductor pattern extending in the X-axis direction. The area of the columnar conductor pattern in a plan view from the X-axis direction is greater than or equal to the area of the via conductor pattern in a plan view from the Z-axis direction.