LC Resonator Shield Structure With Protective Layer Adhesion
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Solution Overview
Problem
Existing electronic components with shields formed on laminates using sputtering face issues with adhesiveness due to surface roughness and material factors, leading to potential peeling and deterioration of inductor characteristics under thermal shock, and difficulty in increasing contact area for reliable connections.
Innovation Solution
An electronic component design featuring a protective layer that covers the shield conductor on the substrate, enhancing adhesiveness by straddling the interface between the shield and substrate, and using interlayer-connection conductors for improved electrical connections, while minimizing shield coverage to reduce magnetic flux shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the shield is formed on the laminate using sputtering, then the electromagnetic-noise shielding property is improved, but the adhesiveness between the shield and the laminate deteriorates due to surface roughness and material factors
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the laminate and the shield. This adhesive layer specifically addresses the adhesion problem caused by surface roughness and material incompatibility, while the shield maintains its electromagnetic shielding function. The adhesive layer acts as a mediator that ensures reliable bonding without compromising the shield's shielding performance.
Solution Approach 2:
The surface of the laminate is subjected to surface treatment (such as plasma treatment, chemical etching, or sanding) to modify its physical and chemical properties. This changes the surface energy and roughness parameters, thereby improving the wettability and bonding strength between the laminate and the adhesive layer, which in turn enhances the overall adhesiveness of the shield assembly.
2Object-affected harmful factors
If the shield covers the top surface and side surfaces of the laminate, then the electromagnetic-noise shielding property is improved, but the magnetic flux generated by the inductor is shielded, causing deterioration of inductor characteristics
Solution Approach 1:
The shield is selectively positioned to cover only specific areas where electromagnetic noise shielding is most critical, rather than uniformly covering the entire laminate. The adhesive layer is applied in a pattern that provides bonding strength where needed while leaving other areas open. This localized approach maintains shielding effectiveness for noise protection while minimizing interference with the inductor's magnetic flux in its operational region.
Solution Approach 2:
The shield structure is divided into multiple segments or zones with different coverage areas. The top surface may have full shield coverage for noise protection, while the side surfaces have selective coverage or reduced thickness. This segmentation allows the shield to provide electromagnetic noise shielding where required while maintaining magnetic flux paths for the inductor, thus resolving the contradiction between shielding performance and inductor characteristics.
3Reliability
If the contact area between the shield and the laminate is increased, then the connection reliability is improved, but the device complexity increases
Solution Approach 1:
A composite structure is employed consisting of the laminate, adhesive layer, and shield. The adhesive layer is a specialized composite material designed to provide strong bonding between the laminate and shield while maintaining a relatively thin profile. This composite approach increases connection reliability through enhanced adhesion without significantly increasing the overall device complexity, as the adhesive layer integrates seamlessly with the existing laminate and shield components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves shield adhesiveness and connection reliability, suppresses unnecessary resonance, and allows flexible LC resonator placement without high parasitic capacitance, while maintaining electromagnetic noise shielding.
Implementation Method 1
a protective layer that covers at least a part of the shield conductor disposed on the one principal surface, out of the pair of principal surfaces, and also covers at least a part of the one principal surface, in a manner straddling at least a part of an interface between the shield conductor disposed on the one principal surface and the substrate body
Implementation Method 2
The shield is formed on the laminate using sputtering
Implementation Method 3
The shield reduces the effect of electromagnetic noise, e.g., that from external of the laminated electronic component, on the inductor and the capacitor
Data Source
AI summary
To provide an electronic component capable of improving the adhesiveness of the shield conductor provided on the outer surface of the substrate body, to the substrate body, while suppressing a deterioration of the characteristics of an LC resonator provided in the substrate body. An electronic component comprises substrate body that includes substrates being insulating and laminated, and that has principal surfaces and side surface, LC resonator that includes inductor conductor disposed on substrates and capacitor conductor disposed on substrates and electrically connected to the inductor conductor, shield conductor that is disposed on principal surface and that is electrically connected to a ground, outer electrode that is disposed on principal surfaces and that is electrically connected to the LC resonator, and protective layer that covers shield conductor disposed on principal surface and principal surface, in a manner straddling interface between shield conductor disposed on principal surface and substrate body.