Adjusting Pad Levels LCD Substrate During Chip Bonding
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Solution Overview
Problem
During the manufacturing of liquid crystal displays (LCDs), high heat and pressure applied to bond driver chips to the glass substrate can cause deformation, leading to abnormal light leakage in the normally black mode due to substrate bending.
Innovation Solution
A display apparatus incorporating an adjusting pad with a thickness that gradually reduces from the center towards the sides is used between the supporting surface and the bonding region of the substrate to level the substrate and prevent flexure, ensuring the substrate remains flat and reducing light leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high heat and pressure are applied to bond driver chips to the glass substrate, then the bonding strength is improved, but the substrate deforms and bends causing light leakage
Solution Approach 1:
The adjusting pad is pre-installed on the supporting surface before the substrate is mounted. This preliminary action creates a compensatory structure that counteracts the deformation caused by subsequent high heat and pressure bonding processes, allowing the substrate to return to its original flat state after bonding
Solution Approach 2:
The adjusting pad utilizes the deformation caused by bonding pressure and heat to its advantage. By being positioned at the center of the substrate where deformation occurs most, the pad's elastic properties allow it to compress during bonding and then push back to restore flatness, converting the harmful deformation into a beneficial self-correcting mechanism
2Ease of manufacture
If the adjusting pad has uniform thickness, then the manufacturing process is simplified, but it cannot effectively compensate for substrate deformation at different locations
Solution Approach 1:
The adjusting pad features non-uniform thickness with the center portion being thicker than the edge portions. This local quality variation is strategically designed to match the deformation pattern of the substrate during bonding, providing greater compensation where deformation is most severe (center) and less compensation at the edges, thereby achieving precise substrate leveling
Data Source
AI summary
A display apparatus includes a frame, a panel module and an adjusting pad. The frame has a supporting surface, and the panel module includes a substrate and a plurality of chips. The substrate is disposed on the supporting surface and has a bonding region at a side of the substrate. The chips are disposed on the bonding region, wherein the chips and the supporting surface are located at two opposite surfaces of the substrate. The adjusting pad is disposed between the supporting surface and the bonding region, and the thickness of the adjusting pad is gradually reduced from a center portion of the adjusting pad toward two sides of the adjusting pad. Another display apparatus, in which a frame and an adjusting pad are integrated into one piece, is provided.