LCD Array Substrate Metal Shielding for Bonding Lead Protection
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Solution Overview
Problem
The existing array substrates in LCD panels face a short-circuiting issue due to misalignment of gold fingers during bonding, which causes conduction between different signal leads when the protection layer is crushed.
Innovation Solution
Incorporating a second metal pattern layer in the protection layer above the bent signal leads to provide protection and withstand bonding pressure, preventing short circuits without additional production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the protection layer is made thin to reduce frame width, then the frame becomes narrower, but the signal leads become vulnerable to crushing and short circuits during bonding
Solution Approach 1:
The protection layer is constructed as a composite structure with a first protection layer (insulating material) and a second protection layer (conductive material). This composite structure provides both mechanical protection and electrical shielding, preventing short circuits while maintaining a thin overall profile that enables narrow frame design.
Solution Approach 2:
The solution adds a vertical dimension by stacking two protection layers with different functions. The first layer provides base protection and insulation, while the second layer adds conductive shielding. This layered approach protects signal leads without increasing horizontal frame width.
2Reliability
If a thicker protection layer is used to protect signal leads, then short circuit risk is reduced, but the frame width increases
Solution Approach 1:
Instead of uniformly increasing protection layer thickness, the invention uses a composite structure where a thin first protection layer provides base protection and a second conductive protection layer provides additional shielding. This achieves enhanced protection without proportionally increasing frame width.
Solution Approach 2:
The protection structure is optimized locally - the first protection layer provides general protection across the bonding area, while the second conductive protection layer is specifically positioned to shield signal leads during the bonding process. This localized approach provides targeted protection without unnecessary overall thickness increase.
3Reliability
If additional protection structures are added to prevent short circuits, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The second protection layer with conductive material serves multiple functions: it provides electrical shielding to prevent short circuits, acts as an additional mechanical protection layer, and can be integrated with existing conductive contact structures. This multi-functionality reduces the need for separate dedicated protection components.
Solution Approach 2:
The invention merges the protection function with the existing layered structure of the array substrate. The first and second protection layers are integrated into the existing manufacturing process flow, combining protection functionality with the structural layers already present in the display device.
Data Source
AI summary
An array substrate, an LCD panel and an LCD apparatus are provided, the array substrate includes: a base substrate, a first metal pattern layer and a protection layer stacked in sequence; a display area and a peripheral area surrounding the display area, the peripheral area includes a bonding area and a non-bonding area, and the bonding area is disposed on at least one side outside the display area; where the first metal pattern layer includes a plurality of conductive contacts disposed in the bonding area and arranged at intervals along a first direction and a plurality of bent signal leads disposed in the non-bonding area, the protection layer includes a first insulation layer and a second metal pattern layer stacked in sequence, and along a thickness direction of the base substrate, the first insulation layer is disposed on a side of the second metal pattern layer approaching the base substrate.