LCD Backlight Bonding Units for Heat Dissipation
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Solution Overview
Problem
The fully sealed backlight structures of liquid crystal display (LCD) panels result in low heat dissipation efficiency due to heat being trapped inside, causing rapid temperature increases that affect the performance of the LCD panel.
Innovation Solution
A backlight structure with a flat backboard and independently arranged bonding units, such as strip-shaped adhesive tapes or independent bonding points, that allow for air circulation and expose part of the light sources' surface for heat dissipation, improving the heat dissipation area and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a fully sealed backlight structure is used, then the structural integrity and sealing are improved, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The bonding units are divided into multiple independent units spaced apart from each other, creating a segmented structure that allows air circulation channels between adjacent units. This segmentation maintains structural integrity while enabling heat dissipation through the gaps, resolving the contradiction between sealing and heat dissipation.
2Temperature
If the bonding units are arranged with large spacing, then the heat dissipation efficiency is improved, but the structural stability deteriorates
Solution Approach 1:
The bonding units are designed with differentiated local characteristics: they provide strong bonding capability where needed (at the contact surfaces with light sources) while maintaining appropriate spacing in other areas to enable heat dissipation. This local quality differentiation allows the structure to simultaneously achieve stability and thermal management.
3Strength
If the contact surface area between light sources and bonding units is increased, then the bonding strength is improved, but the heat dissipation area of light sources deteriorates
Solution Approach 1:
The bonding units contact only a portion of the light source surface rather than covering the entire surface. This partial action provides sufficient bonding strength to secure the light sources while deliberately leaving portions of the light source surface exposed for heat dissipation, thus resolving the contradiction between bonding strength and heat dissipation area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation by creating gaps for air circulation and increasing the exposed surface area of the light sources, leading to improved thermal management and performance of the LCD panel.
Implementation Method 1
a heat generated during operation is difficult to diverge... gaps for air circulation exist between the plurality of light sources... promotes the heat dissipation rate
Implementation Method 2
an area of a projection of a contact surface between the light sources and the bonding units on the backplane is less than or equal to an area of a projection of the light sources on the backboard... increases the exposed surface area of the light sources
Data Source
AI summary
A backlight structure, a liquid crystal display (LCD) panel and an electronic device. The backlight structure includes a backboard, a plurality of bonding units spaced apart on the backboard, a plurality of light sources fixed to the backboard by the plurality of bonding units, wherein an area of a projection of a contact surface between the light sources and the bonding units on the backplane is less than or equal to an area of a projection of the light sources on the backboard.