LCD Backlight PCB Fixing Member Heat Dissipation
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Solution Overview
Problem
Liquid crystal displays (LCDs) using light-emitting diodes (LEDs) as backlights face heat dissipation issues, leading to increased temperatures and potential deformation of components due to thermal stress, which degrades the reliability of electronic circuits and the LCD device.
Innovation Solution
A backlight unit with a printed circuit board (PCB) and a fixing member that includes a heat conducting material to efficiently dissipate heat from LEDs, where the PCB is press-inserted into place during manufacturing, utilizing a base portion and a support portion with an insertion receiving structure to secure the PCB and facilitate heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LEDs are used as light sources in LCD backlights, then power consumption is reduced and useful life is extended, but heat generation increases causing thermal stress and component deformation
Solution Approach 1:
The patent converts the harmful heat generated by LEDs into a beneficial feature by integrating a heat-conducting plate that channels this heat away from sensitive electronic components. The fixing member is specifically designed with heat-conducting properties to transfer heat from the PCB to the housing, transforming the thermal problem into a controlled heat dissipation solution.
Solution Approach 2:
The patent introduces a heat-conducting plate as an intermediary element between the LED light sources and the housing. This intermediate structure serves as a thermal bridge, facilitating heat transfer from the LEDs through the PCB to the housing, thereby protecting sensitive components from direct thermal exposure.
2Duration of action of stationary object
If LEDs are used as light sources, then device lifespan is extended, but thermal stress causes deformation of parts and casings
Solution Approach 1:
The patent addresses the deformation issue by converting the harmful thermal stress into a controlled heat dissipation pathway. The heat-conducting fixing member and plate structure channel heat away from sensitive components, preventing the thermal expansion and contraction that causes deformation over time.
Solution Approach 2:
The patent changes the thermal parameters of the system by introducing materials with high thermal conductivity in the fixing member and heat-conducting plate. This parameter change in thermal conductivity allows for more efficient heat distribution, reducing localized thermal stress that would otherwise cause deformation.
3Stability of the object's composition
If a fixing member is designed to secure the PCB, then structural stability is improved, but heat dissipation capability must also be enhanced
Solution Approach 1:
The fixing member is designed with multi-functionality, serving both as a structural element to secure the PCB and as a thermal management component to dissipate heat. By integrating heat-conducting properties into the fixing member, the patent eliminates the need for separate structural and thermal management components.
Solution Approach 2:
The patent merges the structural support function and heat dissipation function into a single integrated fixing member. The heat-conducting plate is also merged with the fixing member structure, creating a unified component that simultaneously provides mechanical stability and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by LEDs, reducing thermal stress and enhancing the reliability of the LCD device by maintaining a stable temperature and preventing component deformation.
Implementation Method 1
the PCB has a first heat conducting material configured to transfer heat energy away from the LEDs
Implementation Method 2
the PCB fixing member has a second heat conducting material configured to thermally couple with the first heat conducting material and to thereby continue the transfer of heat energy away from the LEDs
Data Source
AI summary
Provided is a backlight unit within a liquid crystal display (LCD) device where the backlight unit includes one or more light-emitting diodes (LEDs) mounted on a printed circuit board (PCB). Positioning of the PCB and its LEDs is provided by a PCB fixing member which includes a base portion and a support portion extending upward from a surface of the base portion. The PCB fixing member is structured to transfer heat energy away from the PCB and to an attached portion of the LCD device such as to a lower housing which houses the PCB and the PCB fixing member. The PCB fixing member includes a press-fit insertion groove into which at least part of the PCB can be easily inserted, thus simplifying manufacturing while assuring appropriate heat dissipation.