LCD Backplane Void Spaces and Segmented Sheets
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Solution Overview
Problem
The complex structure and high manufacturing cost of LCD backplanes, particularly due to the need for numerous bumps on circuit board attaching areas, complicate the manufacturing process and increase costs.
Innovation Solution
A simplified backplane design for LCD back light modules featuring void spaces on the backplane corresponding to circuit boards attached to the back cover, allowing the use of multiple simpler backplane sheets joined by laser welding, eliminating the need for bumps and reducing material and processing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bumps are processed on the circuit board attaching area of the backplane, then the circuit boards can be attached, but the structure becomes complicated and manufacturing cost increases
Solution Approach 1:
The backplane is divided into multiple backplane sheets (first backplane sheet, second backplane sheet, third backplane sheet, fourth backplane sheet) that are joined together. The circuit board attaching devices are integrated into the back cover rather than being processed on the backplane, simplifying the backplane structure while maintaining attachment functionality.
Solution Approach 2:
The circuit board attaching devices are extracted from the backplane and relocated to the back cover. This extraction eliminates the need for complex bump processing on the backplane, reducing structural complexity while preserving the circuit board attachment function through the back cover's attaching devices.
2Reliability
If bumps are processed on the circuit board attaching area, then circuit boards can be attached, but the manufacturing process becomes complicated and cost increases
Solution Approach 1:
The backplane is segmented into multiple sheets that can be manufactured separately and then joined. This segmentation allows each sheet to be manufactured with simpler, less costly processes, avoiding the need for complex bump processing on a single large backplane.
Solution Approach 2:
The circuit board attaching devices are extracted from the backplane manufacturing process and relocated to the back cover. This extraction simplifies the backplane manufacturing process by eliminating the need for bump processing, reducing both manufacturing complexity and cost.
3Stability of the object's composition
If the backplane is integrally formed with complex structure, then it provides comprehensive support, but it requires large tonnage stamping press and increases cost
Solution Approach 1:
The backplane is divided into multiple backplane sheets (first, second, third, fourth sheets) that are joined together to form the complete backplane structure. This segmentation allows each sheet to be stamped using smaller tonnage presses, reducing equipment cost and manufacturing complexity while maintaining the overall structural support function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the backplane structure, reduces material costs, and facilitates more efficient stamping with smaller tonnage equipment, while maintaining the functionality of attaching circuit boards through a simpler process.
Implementation Method 1
The backplane sheets are joined by a method of laser welding
Data Source
AI summary
The present invention discloses a liquid crystal display (LCD) and a backplane of a back light module thereof. The LCD comprises a back cover, one or more circuit boards and a backplane of a back light module. One or more circuit board attaching devices for attaching the circuit boards are arranged on the interior sidewall of the back cover and void spaces for avoiding the circuit boards are arranged at the corresponding position of the backplane. As the circuit boards installed prior to this invention on the backplane is now installed on the back cover instead, the backplane of the back light module of the LCD is not provided with the bumps for attaching the circuit boards any more; the structure of the backplane and the manufacturing process of the backplane are simpler. Furthermore, as the back cover is insulated, the bumps are not arranged, and the circuit boards can be attached by simple circuit board attaching devices, significantly simplifying the process.