LCD Bonding Pad Segmentation for Electrostatic Shielding

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

LCD devices face reliability issues due to induced electrostatic charges, which can damage pixels and static electricity prevention circuits, leading to defective manufacturing and reduced reliability.

Innovation Solution

The LCD device incorporates modified bonding pad portions and signal lines with first and second metal patterns separated by a fixed distance, covered by insulation and protective layers, and connected via contact holes, to shield static electricity effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional bonding pad portions and signal lines are used, then manufacturing is simple and cost-effective, but electrostatic charges are induced into the LCD panel causing pixel and circuit damage

Engineering Contradiction:
ImproveLCD panel reliabilityVSAvoidbonding pad structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The bonding pad portion is divided into multiple separate first metal patterns instead of a single continuous pad. These segmented patterns are arranged in a specific configuration and connected through contact holes to a second metal pattern, creating a shielded structure that prevents electrostatic charge induction while maintaining manufacturing feasibility

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The second metal pattern acts as an intermediary shield between external electrostatic sources and the internal circuit elements. This intermediate structure intercepts and redirects electrostatic charges away from sensitive pixels and circuits, protecting the LCD panel without requiring complete redesign of the bonding interface

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If static electricity prevention circuits are added to protect against electrostatic charges, then reliability improves, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveprotection against electrostatic damageVSAvoidcircuit structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Instead of adding separate protection circuits to combat electrostatic harm, the invention converts the bonding pad structure itself into a protective element. The segmented metal patterns and contact hole configuration create an inherent electrostatic shield that prevents charge induction at its source, eliminating the need for additional prevention circuits

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The electrostatic protection is built into the bonding pad structure before signals are transmitted to the LCD panel. By pre-configuring the metal patterns and contact holes to form a shielded architecture, the design prevents electrostatic damage before it can occur, rather than relying on reactive protection circuits

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8879039B2Liquid crystal display device having second metal patern connected to plurality of first metal patterns through contact holes
Publication Date: 2014.11.04 LG DISPLAY CO LTD
  • US8879039B2 patent drawing
  • US8879039B2 patent drawing
  • US8879039B2 patent drawing

AI summary

An LCD device is disclosed. The LCD device includes a liquid crystal panel configured to include a bonding portion formed in its one edge, pluralities of gate and data lines arranged on it, and pixel regions defined by the gate and data lines. The bonding portion includes: first metal patterns formed away from each other and on a substrate of the liquid crystal panel; a gate insulation film and a protective layer sequentially formed to cover the first metal patterns; and a second metal pattern formed on the protective layer and electrically connected to the first metal patterns partially exposed by contact holes which are formed by partially etching the gate insulation film and protective layer.