LCD Panel Buffer Layer Layout for Thin-Bezel Crack Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LCD devices face issues with mechanical strength and durability due to thin substrates making them vulnerable to external impact and stress, and the array substrate is prone to cracking.
Innovation Solution
Incorporating an organic buffer layer between the first substrate and the thin film transistor, with an optional inorganic buffer layer, to enhance mechanical strength and durability, and placing the color filter substrate between the array substrate and the backlight unit to minimize bezel width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the substrate thickness is reduced to minimize bezel width, then the display area is maximized, but the mechanical strength and durability deteriorate
Solution Approach 1:
The patent employs composite material structures by integrating multiple layers including the array substrate, color filter substrate, liquid crystal layer, and various functional films. This composite structure distributes mechanical stress across multiple layers, enhancing overall durability while maintaining thin profile and maximizing display area.
Solution Approach 2:
The patent utilizes thin film structures for the array substrate and color filter substrate, optimized to provide sufficient mechanical strength while minimizing thickness. The thin film design allows for reduced bezel width while incorporating stress-distribution patterns and reinforcement structures within the film layers themselves.
2Length of moving object
If the array substrate is made thin to reduce device thickness, then the device becomes thinner, but the substrate becomes vulnerable to external impact and stress
Solution Approach 1:
The patent incorporates protective functional layers and stress-distribution structures within the thin substrate design that act as pre-positioned cushioning elements. These structures are designed to absorb and distribute impact forces before they can cause damage to the thin array substrate, enabling both thin profile and high reliability.
Solution Approach 2:
The thin array substrate is constructed as part of a composite structure involving multiple functional layers with different mechanical properties. This composite design allows the overall assembly to be thin while maintaining high impact resistance through the synergistic combination of materials with complementary strength characteristics.
3Strength
If inorganic buffer layers are used to improve mechanical strength, then durability improves, but the layers become prone to cracking under external impact
Solution Approach 1:
The patent applies buffer layers with locally optimized properties, using organic materials in specific regions where flexibility and crack resistance are critical, while using inorganic materials in regions requiring high structural strength. This local differentiation allows the structure to resist cracking while maintaining overall mechanical strength.
Solution Approach 2:
The patent modifies the physical and chemical parameters of buffer layer materials, including thickness, composition ratios, and cross-linking density, to achieve an optimal balance between mechanical strength and crack resistance. By adjusting these parameters, the buffer layers provide enhanced durability without the brittleness associated with conventional inorganic materials.
Data Source
AI summary
A liquid crystal display device including a liquid crystal panel including a first substrate, a thin film transistor on the first substrate, an organic buffer layer between the first substrate and the thin film transistor, a second substrate, a color filter layer on the second substrate, and a liquid crystal layer between the first and second substrates, and a backlight unit below the liquid crystal panel. The second substrate is between the backlight unit and the first substrate.