LCD Module Case Top Holes for Driving IC Spacing
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Solution Overview
Problem
In LCD modules with COG-type driving ICs, the thinning of components leads to potential contact between the case top and the driving IC, causing cracks and operational issues, and attempts to prevent this by reducing IC thickness or size result in increased costs or compromised protection against vibrations and impacts.
Innovation Solution
The LCD module design includes a case top with holes corresponding to the driving ICs, allowing them to be thicker and preventing contact, while maintaining protection by not covering the upper polarizer and using thinner substrates to reduce thickness without limiting IC thickness, thus preventing cracks and operational failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of substrates and optical sheets is reduced to make the LCD module thinner, then the overall thickness decreases, but the distance between the case top and driving IC becomes too short causing potential contact and operational failures
Solution Approach 1:
The case top is segmented with through-holes at specific locations where driving ICs are mounted. This segmentation allows the driving ICs to protrude through the case top, maintaining adequate spacing and preventing contact between the IC and the case top inner surface, thereby resolving the reliability issue while enabling thinner substrate design
Solution Approach 2:
The case top with through-holes acts as an intermediary structure that accommodates the driving ICs protruding through it. This design allows the ICs to be positioned at an optimal distance from the liquid crystal panel while still being protected and supported by the case structure, preventing direct contact that would cause operational failures
2Reliability
If the thickness of the driving IC is reduced to prevent contact with the case top, then contact issues are avoided, but manufacturing costs increase due to additional grinding processes
Solution Approach 1:
Instead of reducing the IC thickness to prevent contact (conventional approach), the invention inverts the approach by making the case top thinner at specific locations through through-holes. This allows the IC to maintain its standard thickness while still preventing contact, thereby avoiding additional IC manufacturing costs
3Length of moving object
If the case top is lowered to reduce LCD module thickness, then the device becomes thinner and lighter, but the protection against vibrations and impacts is compromised
Solution Approach 1:
The case top maintains its standard thickness and protective coverage over most of the liquid crystal panel area, providing adequate protection against vibrations and impacts. Only at specific localized positions where driving ICs are mounted are through-holes created to allow IC protrusion, thus maintaining overall protective strength while enabling thinner design
Data Source
AI summary
A liquid crystal display module includes a bottom cover, a support main over the bottom cover, a backlight unit surrounded by the support main, a liquid crystal panel over the backlight unit and including first and second substrates and a liquid crystal layer interposed between the first and second substrates, a driving unit including a first driving integrated circuit (IC) that is mounted on a first side of the first substrate, and a case top covering edges of a front surface of the liquid crystal panel and combined with the bottom cover, the case top including a first hole corresponding to the driving IC.