LCD Circuit Board Thermal Management via Vertical Reinforcement
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Solution Overview
Problem
Thinner liquid crystal display appliances face challenges in efficiently dissipating heat, leading to temperature rises in heat-susceptible components due to disrupted airflow from blower modules and inadequate natural convection.
Innovation Solution
The circuit board is arranged with reinforcement members extending vertically to separate heat-generating areas, preventing heat transfer and enhancing airflow for efficient heat dissipation by dividing the circuit board mount surface into distinct areas and strategically placing ventilation holes for effective convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the liquid crystal display appliance is made thinner, then the thickness of the outer shape is reduced, but the heat dissipation efficiency deteriorates and heat-susceptible components overheat
Solution Approach 1:
The circuit board is divided into multiple areas by reinforcement members that extend in the vertical direction, separating heat-generating circuits from heat-susceptible components. This segmentation prevents heat transfer between adjacent areas and enables independent thermal management for each region, solving the overheating problem in thin appliances.
2Speed
If a blower module is installed at the bottom to produce forced convection, then air intake from the back side is achieved, but the natural convection airflow is disturbed and heat exhaustion becomes ineffective
Solution Approach 1:
Different regions of the circuit board are designed with different thermal characteristics. Heat-generating circuits are positioned in areas with direct airflow access, while heat-susceptible components are placed in thermally isolated zones. This local differentiation optimizes heat dissipation for each component type without requiring complex active cooling systems.
3Temperature
If reinforcement members are added to separate heat-generating areas, then heat transfer between adjacent areas is prevented, but the device complexity increases
Solution Approach 1:
The reinforcement members serve multiple functions simultaneously: they provide structural support for the circuit board, act as thermal barriers to prevent heat transfer, and serve as mounting structures for securing the circuit board to the housing. This multi-functionality reduces the need for additional dedicated thermal management components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses temperature rises in heat-susceptible components by isolating heat sources and optimizing airflow for efficient heat exhaustion, maintaining the appliance's thin profile while ensuring component safety.
Implementation Method 1
the heat generating circuit board is arranged into an area substantially divided and separated with reinforcement members which extend in the display vertical direction in order to prevent the heat generated by the heat generating circuit board from being transferred to adjacent areas
Implementation Method 2
a natural ambient convection inside the housing to discharge heat generated within the appliance
Data Source
AI summary
A liquid crystal display apparatus which exhausts heat generated within the apparatus efficiently, and reduces temperature increase in the heat-frail sections is provided.A circuit board mounting surface at the back of the liquid crystal monitor unit is divided into a plurality of board mount areas using the vertically extending reinforcement members. A signal circuit board section and TCON (Timing control) circuit board section are disposed in the same board mount area which is different from the partition where the power supply circuit board section resides. By arranging this way, the temperature increase in the heat-frail sections of the signal circuit board section is reduced, and the hot air heated by the power supply circuit board in the power supply circuit board section goes up along the reinforcement members, thus an efficient heat exhaustion is achieved.