Borderless LCD COF Routing via Side Gaps
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Solution Overview
Problem
Current borderless liquid crystal display (LCD) designs struggle to effectively hide the chip-on-film (COF) due to the larger lower glass substrate, making it difficult to achieve a seamless borderless design.
Innovation Solution
The design incorporates a mold frame with a concave trench and a border frame part that includes a shielding part and connecting parts to accommodate and shield the flexible circuit board, along with routing gaps in the glass substrates to route the COF, allowing it to be hidden within the LCD panel, and uses a transparent plate to fill gaps for a seamless appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lower glass substrate is made larger than the upper substrate to bond the COF, then the COF can be mounted, but the borderless design cannot be achieved
Solution Approach 1:
The patent extracts the COF and flexible circuit board from the traditional OLB area and relocates them to route through the side of the liquid crystal display panel. This separation allows the glass substrates to be the same size while still accommodating the COF mounting requirements.
Solution Approach 2:
Instead of extending the lower substrate in one dimension to create an OLB area, the patent routes the flexible circuit board through the side dimension of the panel, utilizing the depth/side space rather than increasing the front surface area.
2Ease of manufacture
If the COF is mounted on the OLB area, then the driving chip can be bonded, but the COF cannot be hidden effectively
Solution Approach 1:
The patent nests the COF and flexible circuit board within the side routing gap structure. The COF is mounted on the side surface, and the flexible circuit board is routed through the same side area, hiding these components within the panel's depth rather than exposing them on the front surface.
Solution Approach 2:
The patent uses a flexible circuit board with metal wires to connect the driving chip to the liquid crystal display panel. This flexible connection allows the COF to be positioned on the side rather than the front, enabling it to be hidden while maintaining electrical connectivity.
3Shape
If routing gaps are created in the glass substrates to hide the COF, then the borderless design is achieved, but the structural integrity may be compromised
Solution Approach 1:
The patent creates routing gaps only in specific local areas of the glass substrates where needed for COF accommodation, rather than compromising the overall structure. The gaps are positioned at the sides where they are less visible and do not significantly affect the main structural integrity of the panel.
Data Source
AI summary
The invention provides a liquid crystal display (LCD), which comprises: back plate; light-guiding plate, disposed on top of back plate; optical film, disposed on top of light-guiding plate; mold frame, connected to back plate to fix optical film and light-guiding plate; LCD panel, disposed on top of mold frame, comprising upper and lower glass substrates disposed oppositely, both glass substrates comprising bottom surface, top surface and side surface connecting top and bottom surfaces; driving chip, flexible circuit board, comprising metal wire and connected to LCD panel; wherein driving chip bonded to flexible circuit board, coupled through metal wire of flexible circuit board to LCD panel; joint of bottom and side surfaces of upper glass substrate disposed with first routing gap, flexible circuit board connected to LCD panel routing through first routing gap. The LCD can effectively hide COF in liquid crystal display to maximize borderless LCD design.