Curved Dam Structure for LCD Alignment Film Isolation

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Solution Overview

Problem

In conventional LCD devices with narrow frames less than 2.4 mm, the alignment film manufactured by inkjet printing often covers the bonding lead, leading to poor conductivity between the COF substrate and the bonding lead, causing display abnormalities due to its insulating nature.

Innovation Solution

A curved dam structure is introduced on the array substrate near the bonding lead to isolate the alignment film, preventing the ink from covering the bonding lead, utilizing a curved convex structure with a height of 2-4 μm and an arc width of 5-50 μm to direct the ink away from the bonding lead.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If inkjet printing is used to manufacture alignment films, then manufacturing efficiency is improved, but the alignment film may uncontrollably expand at the edges, covering the bonding lead and reducing conductivity

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidedge expansion control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

A dam structure is formed at the edge of the array substrate before the inkjet printing process. This preliminary structure acts as a barrier that prevents the alignment film ink from expanding beyond the designated area and covering the bonding lead, thus solving the edge expansion control issue while maintaining the efficiency of inkjet printing

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The dam structure serves as an intermediary element between the alignment film and the bonding lead. It isolates the insulating alignment film from the bonding lead, preventing direct contact and ensuring that the bonding lead remains conductive and accessible for connection to the COF substrate

Inventive Principle:
Principle #24Intermediary (Mediator)

2Stability of the object's composition

If the alignment film covers the bonding lead, then the bonding area is sealed, but conductivity between COF substrate and bonding lead becomes poor due to insulating material

Engineering Contradiction:
Improvebonding area sealingVSAvoidconductivity
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The bonding area is segmented into distinct regions: a first bonding area for connecting to the COF substrate and a second bonding area for connecting to the PCB. The dam structure creates a clear boundary that separates the alignment film from the first bonding area, ensuring that the bonding lead in the first bonding area remains exposed and conductive while still allowing the alignment film to cover the second bonding area for sealing purposes

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11567372B2TFT-LCD device
Publication Date: 2023.01.31 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US11567372B2 patent drawing
  • US11567372B2 patent drawing
  • US11567372B2 patent drawing

AI summary

The disclosure provides a liquid crystal display (LCD) device including a display area and a non-display area, a bonding area is further disposed in the non-display area, a bonding lead is formed on an array substrate in the bonding area, and a first alignment film is further disposed on the array substrate. A dam is disposed on a side of the bonding lead near an edge of the display area, and the first dam is configured to isolate the first alignment film from the bonding lead.