LCD Driving Chip Layout with Internal Wire Bends
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Solution Overview
Problem
Existing methods for reducing the margin area width at the bottom of LCDs in portable electronic devices are ineffective, as they either require a minimum distance between the panel and the driving chip, leading to inefficient signal transmission and increased production costs due to larger margin areas.
Innovation Solution
A method of forming a first and second pin group for outputting gate driving signals, with the second pin group's wires routed inwardly through the driving chip, reducing the number of horizontal pins and eliminating the need for vertical pins, thereby decreasing the distance between the panel and the driving chip and minimizing the margin area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are routed with bends on the substrate to connect pins to the panel, then signal transmission is achieved, but the distance between the panel and driving chip must be larger than a minimum distance, increasing the margin area width
Solution Approach 1:
The patent applies dimensionality change by routing wires through the interior volume of the driving chip rather than along the substrate surface. This moves the wiring from a 2D substrate plane to a 3D path through the chip interior, allowing wires to reach pins without requiring large external bending space. The margin area width is reduced from (d1+h1) to (d2+h2) where d2 < d1, while maintaining proper wire angles for signal transmission.
Solution Approach 2:
The patent implements nesting by placing wire bends inside the driving chip structure. Instead of wires bending externally on the substrate, the wire paths are nested within the chip's physical boundaries. This internal routing allows the wires to achieve necessary bending angles for signal transmission while occupying space that would otherwise be external margin area.
2Area of stationary object
If pins are arranged along the vertical direction of the driving chip, then the number of horizontal pins decreases, but the height of the driving chip increases, limiting margin area reduction
Solution Approach 1:
The patent uses dimensionality change to resolve the pin arrangement dilemma. Instead of adding vertical pins that increase chip height, all pins are arranged along the horizontal direction and wires are routed through the chip interior in three dimensions. This allows pin count reduction without height penalty, as the wiring complexity is absorbed in the internal 3D space rather than expanding the chip's external footprint.
3Area of stationary object
If the distance between the panel and driving chip is reduced, then the margin area width decreases, but the bending angles of wires become smaller than the required angle, preventing efficient signal transmission
Solution Approach 1:
The patent resolves this contradiction by moving wire routing from 2D substrate surface to 3D chip interior. Wires can maintain proper bending angles by traveling through the chip's internal volume, even when the external distance between panel and chip is reduced. The minimum distance requirement is reduced from d1 to d2 because the critical bending space is internal rather than external.
Solution Approach 2:
The driving chip structure itself acts as an intermediary that provides internal routing space. The chip's internal architecture serves as a mediator between the panel and external connections, allowing wires to achieve proper bending angles within the chip rather than requiring large external clearance. This intermediary structure enables compact external dimensions while maintaining internal wiring quality.
Data Source
AI summary
A method of layout of a driving chip of an LCD, for reducing a size of the LCD, includes forming a first pin group including a plurality of pins utilized for outputting gate driving signals along a first direction, forming a second pin group including a plurality of pins utilized for outputting gate driving signals along the first direction, forming a first wire group including a plurality of wires each coupled between a pin of the first pin group and a panel of the LCD, and forming a second wire group including a plurality of wires each coupled between a pin of the second pin group and the panel, wherein each wire of the second wire group includes at least a bender formed inside the driving chip.