Semi-Transmission LCD Electrode Formation Using Single Resist Mask
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Solution Overview
Problem
Conventional semi-transmission type liquid crystal display devices require multiple resist masks for forming reflective and transparent electrodes, increasing manufacturing steps and costs.
Innovation Solution
A method where a single resist pattern with varying film thickness is used to form both reflective and transparent electrodes, with the reflective electrode's entire under surface in contact with the transparent electrode, reducing the number of manufacturing steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple resist masks are used to form reflective and transparent electrodes separately, then the electrodes can be formed with precise patterns, but the number of manufacturing steps increases and manufacturing cost increases
Solution Approach 1:
The patent combines the formation of reflective and transparent electrodes into a single photolithography step by using one resist mask that defines both electrode types. The resist mask includes openings that expose both the reflective electrode regions and transparent electrode regions simultaneously, eliminating the need for separate masking steps for each electrode type while maintaining precise pattern formation.
Solution Approach 2:
The single resist mask serves multiple functions: it defines the pattern for reflective electrodes, defines the pattern for transparent electrodes, and controls the deposition process for both electrode materials. This multi-functional approach replaces what would traditionally require multiple specialized masks, reducing manufacturing complexity while preserving precision.
2Manufacturing precision
If multiple resist masks are used to form reflective and transparent electrodes separately, then the electrodes can be formed with precise patterns, but the manufacturing time increases
Solution Approach 1:
The patent merges multiple sequential operations (forming resist mask for reflective electrode, forming reflective electrode, removing first mask, forming resist mask for transparent electrode, forming transparent electrode) into a single integrated operation. One resist mask is formed that simultaneously defines both electrode patterns, and a single deposition process forms both electrodes through selectively positioned openings in the mask.
Solution Approach 2:
The resist mask is designed in advance with the complete pattern information for both reflective and transparent electrodes embedded in its structure. The mask includes strategically positioned openings that pre-determine where each electrode type will be formed, allowing both electrodes to be created in one deposition step without requiring sequential mask formation and removal.
3Manufacturing precision
If multiple resist masks are used to form reflective and transparent electrodes separately, then the electrodes can be formed with precise patterns, but the manufacturing cost increases
Solution Approach 1:
The patent consolidates multiple expensive photolithography steps into a single step. By forming one resist mask that defines both electrode patterns and using it for a single deposition process, the method eliminates the repeated costs of resist material, mask fabrication, and photolithography processing that would accumulate with multiple separate steps.
Solution Approach 2:
The single resist mask performs multiple functions that would traditionally require separate masks: defining reflective electrode patterns, defining transparent electrode patterns, and controlling the deposition of both electrode materials. This universal mask approach reduces material costs and processing costs while maintaining the precision needed for both electrode types.
Data Source
AI summary
In a semi-transmission liquid crystal display device, two resist masks are required to form a reflective electrode and a transparent electrode; therefore, cost is high. A transparent electrode and a reflective electrode which function as a pixel electrode are stacked. A resist pattern which includes a region having a thick film thickness and a region having a thinner film thickness than the aforementioned region is formed over the reflective electrode by using a light exposure mask which includes a semi-transmission portion. The reflective electrode and the transparent electrode are formed by using the resist pattern. Therefore, the reflective electrode and the transparent electrode can be formed by using one resist mask.