Thermal-Conductive LCD Frame for LED Heat Management

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Solution Overview

Problem

Existing liquid crystal display (LCD) apparatuses using light emitting diodes (LEDs) as light sources face issues with heat management, leading to increased size, reduced display quality, and inefficient energy use due to the need for large heat radiating structures and lack of effective heat emission from the controller, as well as unnecessary electromagnetic wave shielding components.

Innovation Solution

A liquid crystal panel assembly and LCD apparatus design featuring a housing and frame made of thermal-conductive materials to effectively manage heat from the LED light source, reducing the size and improving display quality by facilitating heat emission and integrating electromagnetic wave shielding into the thermal-conductive frame.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If LED is used as light source, then energy efficiency is improved and lifespan is extended, but heat generation increases causing deterioration of light emitting performance

Engineering Contradiction:
Improveenergy efficiencyVSAvoidheat generation
Core Design Contradiction:
Use of energy by moving objectVSTemperature

Solution Approach 1:

The patent combines the electromagnetic wave shielding function and heat radiating function into a single integrated structure. The frame is constructed with electromagnetic wave shielding material that also possesses thermal conductivity, allowing it to simultaneously shield electromagnetic waves from the controller and radiate heat from the LED light source, thereby resolving the contradiction between energy efficiency improvement and heat generation without requiring separate components

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The frame is designed to perform multiple functions: structural support, electromagnetic wave shielding, and heat radiation. By making the frame兼具 electromagnetic wave shielding capability and thermal conductivity, the patent creates a universal component that addresses both electromagnetic interference and thermal management issues, allowing the system to maintain high energy efficiency while managing heat effectively

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If large heat radiating structures are added, then heat emission is improved, but device size increases

Engineering Contradiction:
Improveheat emissionVSAvoiddevice size
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The patent merges the heat radiating function into the existing frame structure rather than adding separate heat radiating components. The frame is designed with thermal conductivity to radiate heat from the LED, eliminating the need for additional large heat radiating structures and thereby maintaining compact device size while achieving effective heat emission

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The frame serves as both structural support and heat radiating component. By giving the frame dual functionality, the patent avoids adding extra components that would increase device volume, thus resolving the contradiction between improving heat emission and maintaining compact size

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If separate electromagnetic wave shields are added, then electromagnetic interference protection is improved, but device complexity and size increase

Engineering Contradiction:
Improveelectromagnetic interference protectionVSAvoidnumber of components
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines electromagnetic wave shielding material into the frame structure itself, creating an integrated component that provides both structural support and electromagnetic interference protection. This eliminates the need for separate electromagnetic wave shields, thereby reducing device complexity and component count while maintaining effective shielding

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The frame is designed to simultaneously provide structural support and electromagnetic wave shielding. By making the frame兼具 these two functions, the patent reduces the total number of components needed, simplifying the device structure while maintaining comprehensive electromagnetic interference protection

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances heat dissipation from the LED light source, improves display quality, and increases energy efficiency by minimizing power consumption and eliminating the need for separate electromagnetic wave shields, resulting in a more compact and high-performance LCD apparatus.

Implementation Method 1

a housing and frame made of thermal-conductive materials to effectively manage heat from the LED light source

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a light emitting diode (LED) is in the spotlight as the light source for use in the backlight module. The LED is a light emitting element, which produces light by a light emitting phenomenon generating when a voltage is applied to a semiconductor

Methodology Applied
Scientific EffectLight emitting diode effect: Light Emitting Diode

Data Source

PatentUSRE49065E1Liquid crystal panel assembly and liquid crystal display apparatus having the same
Publication Date: 2022.05.10 SAMSUNG ELECTRONICS CO LTD
  • USRE49065E1 patent drawing
  • USRE49065E1 patent drawing
  • USRE49065E1 patent drawing

AI summary

A liquid crystal panel assembly includes a liquid crystal panel, a backlight module having at least one light emitting diode (LED) light source to irradiate light to the liquid crystal panel, and a housing which surrounds the liquid crystal panel and the backlight module. At least a portion of the housing adjacent to the at least one LED light source is formed of a thermal-conductive material.