LCD Frame Protrusions Suppress Glass Substrate Distortion
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Solution Overview
Problem
Liquid crystal display devices experience display irregularities due to thermal distortion of glass substrates caused by differences in heat capacity and thermal expansion coefficients between IC chips and glass substrates during thermocompression bonding, leading to COG irregularities.
Innovation Solution
The implementation of protrusions formed integrally with the upper and middle frames of the liquid crystal display device, which contact the TFT and opposed substrates at the IC chip locations, applies counteracting forces to flatten the substrates and suppress distortion, thereby reducing COG irregularities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid bodies are attached to suppress glass substrate deformation, then deformation suppression is improved, but distortion may be generated by the rigid bodies themselves and manufacturing complexity increases
Solution Approach 1:
The protrusions are formed integrally with the upper frame and middle frame structures, merging the deformation suppression function into the existing frame assembly. This eliminates the need for separate rigid bodies to be attached to the glass substrate, thereby reducing device complexity while maintaining deformation suppression capability.
Solution Approach 2:
The deformation suppression function is extracted from the glass substrate system and transferred to the frame structures. The protrusions on the upper and middle frames apply counteracting forces to the glass substrate, separating the suppression function from the substrate itself and avoiding the complexity of attaching additional components to the substrate.
2Strength
If rigid bodies are used to suppress deformation, then glass substrate rigidity is improved, but the size and material of rigid bodies are restricted
Solution Approach 1:
The upper frame and middle frame structures serve multiple functions: they provide structural support for the display device and simultaneously incorporate protrusions that suppress glass substrate deformation. This multi-functionality eliminates the need for separate rigid bodies with specific size and material constraints.
Solution Approach 2:
The deformation suppression function is merged with the frame structures, which are already present in the display device. The protrusions on the frames apply counteracting forces to the glass substrate, allowing the frame to serve dual purposes without restricting size or material choices.
3Ease of manufacture
If adhesive material is used to attach rigid bodies, then attachment is achieved, but distortion may be generated by the adhesive and attaching method
Solution Approach 1:
The attachment method is extracted from the glass substrate system. Instead of attaching rigid bodies to the substrate using adhesive, the protrusions are formed integrally with the frame structures. This eliminates the adhesive layer that could cause distortion and simplifies the manufacturing process.
Solution Approach 2:
The frame structures with protrusions serve as intermediaries between the deformation suppression function and the glass substrate. The protrusions contact the glass substrate and apply counteracting forces without requiring adhesive materials, thereby avoiding distortion from adhesive and simplifying attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively eliminates substrate distortion and associated display irregularities while minimizing manufacturing costs by integrating protrusions with the frames, rather than using external rigid bodies.
Implementation Method 1
distortion of the glass substrate is generated after thermocompression bonding due to a difference between the coefficient of thermal expansion of the glass substrate and that of the IC chips
Implementation Method 2
the temperature of the IC chips differs from that of the glass substrate due to a difference between the heat capacity of the IC chips and that of the glass substrate
Data Source
AI summary
An object of the present invention is to eliminate COG irregularities around a display area caused by distortion of a glass substrate generated when IC chips are connected by a COG method in a liquid crystal display device. A liquid crystal display panel configured using an opposed substrate and a TFT substrate and a backlight are accommodated using an upper frame and a lower frame. IC chips are connected to an end portion of the TFT substrate of the liquid crystal display panel via ACFs by the COG method. Protrusions formed at the upper frame are in contact with the both sides of each IC chip, and the distortion of the TFT substrate generated by the COG method is eliminated by the protrusions. The TFT substrate can be flattened by eliminating the distortion, and the COG irregularities around the display area can be suppressed.