Graphite Heat Conduction Member for LCD Chassis Thermal Management
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Solution Overview
Problem
Conventional liquid crystal displays (LCDs) with LED backlight units face issues of increased weight and thickness due to heat management, as existing cooling methods like radiating fins, heat pipes, and cooling fans do not adequately address heat dissipation while maintaining a lightweight and slim design.
Innovation Solution
A heat conduction member with a thermal conductivity of at least 220 W/mK, made from materials like graphite, is applied to the external surface of the bottom chassis of the LCD, extending from areas facing the LED units to spaced areas, forming a 'U' or 'L' shape to enhance heat transfer and distribution, thereby improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods (radiating fins, heat pipes, cooling fans) are used to remove heat from LED units, then heat dissipation is improved, but the LCD becomes weighty and thick
Solution Approach 1:
The patent combines the heat conduction function with the existing bottom chassis structure by attaching a heat conduction member (graphite sheet) to the chassis. This merges the cooling function into the structural component rather than adding separate cooling devices, thereby improving heat dissipation while maintaining lightweight design.
Solution Approach 2:
The patent changes the thermal conductivity parameter by introducing a graphite-based heat conduction member with high thermal conductivity (approximately 90 W/mK or higher) to the bottom chassis. This parameter change enables efficient heat transfer from LED units without requiring additional cooling components that would increase weight.
2Temperature
If conventional cooling methods (radiating fins, heat pipes, cooling fans) are used to remove heat from LED units, then heat dissipation is improved, but the LCD thickness increases
Solution Approach 1:
The heat conduction member is integrated onto the existing bottom chassis structure, merging the cooling function with the structural component. This approach provides effective heat dissipation without adding separate cooling devices that would increase the overall thickness of the LCD.
Solution Approach 2:
The patent extracts the heat conduction function from complex mechanical cooling systems (radiating fins, heat pipes, fans) and implements it through a simple graphite-based thermal conduction member attached to the chassis, thereby achieving heat dissipation with minimal thickness increase.
3Temperature
If a heat conduction member with high thermal conductivity is applied to the bottom chassis, then cooling efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent achieves improved cooling efficiency by changing the thermal conductivity parameter through the application of a graphite-based heat conduction member to the bottom chassis. The straightforward attachment process maintains ease of manufacture despite the enhanced thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved cooling efficiency and maintains a lightweight, slim design by effectively dissipating heat generated by LED units, reducing the weight and thickness of the LCD while ensuring efficient heat transfer and assembly productivity.
Implementation Method 1
a heat conduction member disposed across an external surface of the bottom chassis from an area facing the LED unit to an area spaced apart from the LED unit, the heat conduction member having a higher thermal conductivity than the bottom chassis
Data Source
AI summary
An LCD comprises an LCD panel on which an image is formed, a light guiding plate disposed behind the LCD panel, an LED unit disposed along at least one side of the light guiding plate and providing light to the LCD panel, a bottom chassis accommodating the light guiding plate and the LED unit, and a heat conduction member disposed across an external surface of the bottom chassis from an area facing the LED unit to an area apart from the LED unit and having a higher thermal conductivity than the bottom chassis.