LCD Inverter Heat Conduction via Shield Cover
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Solution Overview
Problem
Large LCDs generate excessive heat due to high output transformers, leading to increased power consumption and thermal issues, as existing heat release structures are inadequate for efficient heat dissipation.
Innovation Solution
A heat conduction unit is integrated onto the inverter IC and transformer on the PCB, contacting a shield cover to facilitate effective heat release, utilizing materials like silicon and aluminum oxide for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high output transformers are used in large LCDs, then voltage transformation efficiency is improved, but heat generation increases excessively
Solution Approach 1:
A heat conduction unit is introduced as an intermediary component between the transformer and the shield cover. This heat conduction unit includes a heat conduction pad made of thermally conductive material that transfers heat from the transformer to the shield cover, enabling effective heat dissipation while maintaining the transformer's high power output efficiency
Solution Approach 2:
The heat generated by the transformer, which was previously a harmful byproduct reducing efficiency, is converted into a manageable thermal flow through the heat conduction unit. The heat is redirected to the shield cover which has thermal mass and surface area to dissipate it, transforming the harmful heat into a controlled thermal management problem
2Device complexity
If existing heat release structures are used, then device simplicity is maintained, but heat dissipation efficiency is inadequate
Solution Approach 1:
The heat conduction unit is merged with the existing shield cover structure rather than adding a completely separate heat sink or cooling system. The heat conduction pad is positioned between the transformer and the shield cover, combining the shielding function with the heat dissipation function in a single integrated structure
Solution Approach 2:
The shield cover is given multiple functions: it continues to provide electromagnetic shielding for the inverter components while simultaneously serving as a heat dissipation pathway through the integrated heat conduction unit. This multi-functionality avoids adding separate dedicated heat sinking components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables quick heat dissipation from heating elements, reducing power consumption and enhancing the efficiency of voltage transformation in LCDs.
Implementation Method 1
a heat conduction unit which is attached to the inverter IC and the transformer and conducts heat; and a shield cover which protects the PCB from the exterior and contacts the heat conduction unit on the inverter IC and the transformer
Data Source
AI summary
A liquid crystal display (LCD) device having a heat releasing structure is disclosed to effectively release heat generated from heating elements such as an inverter IC and a transformer formed on an inverter PCB (Printed, Circuit Board). The LCD device includes a lower cover; a backlight unit formed on the lower cover and providing light; a liquid crystal panel separated from the backlight unit and provided with light; an inverter PCB that drives the backlight unit; an inverter IC and a transformer mounted on the PCB and generating voltage supplied to the backlight unit; a heat conduction unit attached on the inverter IC and the transformer and heat-conducted; and a shield cover protecting the PCB from the exterior and contacting with the heat conduction unit on the inverter IC and the transformer to release heat.