Thermoplastic Resin Lateral Bonding for LCD Module Stability
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Solution Overview
Problem
Conventional liquid crystal display modules face challenges in securing the backlight unit and liquid crystal display panel effectively without reducing light transmittance, as existing adhesives often fail to maintain a uniform thickness and stability, especially when exposed to temperature variations, leading to potential damage upon impact.
Innovation Solution
A thermoplastic layer made from a solidified thermoplastic resin with a viscosity of 300 cps to 1,000 cps at 120° C. to 130° C., which is applied to the lateral surfaces of both units, using materials like hot-melt type silicone adhesives, ethylene-vinyl acetate resins, phenolic resins, and epoxy resins, along with a silane coupling agent to enhance adhesion and prevent resin penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesives are used to secure the backlight unit and liquid crystal display panel, then attachment is achieved, but uniform thickness and stability are not maintained, especially under temperature variations
Solution Approach 1:
The patent specifies precise viscosity parameters for the thermoplastic resin at different temperatures (300-1000 cps at 120-130°C) to ensure proper flow and uniform thickness during application, while maintaining stability under temperature variations in the final product
Solution Approach 2:
The patent uses composite thermoplastic resin formulations including specific polymers (ethylene-vinyl acetate, acrylic, phenolic, or epoxy resins) with controlled molecular weights and additives to achieve both uniform thickness and thermal stability
2Strength
If existing adhesives are used to secure the backlight unit and liquid crystal display panel, then attachment is achieved, but the structure lacks rigidity and is susceptible to damage upon impact
Solution Approach 1:
The patent specifies molecular weight ranges (10,000-200,000 g/mol for silicone adhesive, 10,000-50,000 g/mol for ethylene-vinyl acetate resin) to optimize the balance between adhesion strength and impact resistance without complicating the securing structure
Solution Approach 2:
The patent applies thermoplastic resin to the lateral surfaces of both the backlight unit and liquid crystal display panel, creating a curved/rounded securing structure that distributes impact forces more effectively than flat adhesive layers
3Reliability
If adhesive is applied to lateral surfaces, then attachment is achieved, but resin penetration may occur
Solution Approach 1:
The patent controls the viscosity of the thermoplastic resin within specific ranges (300-1000 cps at 120-130°C) to ensure proper adhesion strength while preventing excessive flow that would cause resin penetration into the panel structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved stability, rigidity, and attachment between the backlight unit and the liquid crystal display panel, maintaining light transmittance and preventing resin penetration, thus enhancing the display properties and durability of the module.
Implementation Method 1
forming a thermoplastic layer connecting at least one lateral surface of the backlight unit to at least one lateral surface of the liquid crystal display panel
Implementation Method 2
the thermoplastic layer including a solidified thermoplastic resin
Implementation Method 3
exhibiting viscosity of about 300 cps to about 1,000 cps at a temperature of about 120° C. to about 130° C.
Data Source
AI summary
A liquid crystal display module includes a backlight unit, a liquid crystal display panel on a top surface of the backlight unit, and a thermoplastic layer on at least one lateral surface of the backlight unit and at least one lateral surface of the liquid crystal display panel, the thermoplastic layer including a solidified thermoplastic resin exhibiting viscosity of about 300 cps to about 1,000 cps at a temperature of about 120° C. to about 130° C.