LCD Lift-Off Groove Segmentation for Residual Photoresist Removal
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Solution Overview
Problem
The existing lift-off methods for fabricating liquid crystal display (LCD) devices face challenges in removing photoresist patterns from wide signal lines and metal patterns, leading to image quality degradation due to residual photoresist patterns, which cause shorts and corrosion, especially in non-display regions.
Innovation Solution
A method involving the formation of first and second grooves on the material layers using photoresist patterns, allowing for simultaneous removal of the photoresist and material layers, thereby preventing residual patterns and improving the lift-off process efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional lift-off method is used for wide signal lines and metal patterns, then the fabrication process is simple, but photoresist patterns remain after removal causing shorts and corrosion
Solution Approach 1:
The patent divides the continuous photoresist pattern into segmented regions by forming grooves that extend from the edges toward the center. This segmentation allows the removal solution to access and remove photoresist from multiple locations simultaneously, preventing residual patterns while maintaining process simplicity.
Solution Approach 2:
The patent introduces grooves as intermediary structures that facilitate the action of the removal solution. These grooves act as channels or pathways that enable the solution to penetrate and remove photoresist patterns effectively, serving as a mediator between the removal solution and the photoresist material.
2Reliability
If photoresist patterns are not completely removed, then the lift-off process is efficient, but residual patterns cause shorts and corrosion in non-display regions
Solution Approach 1:
The patent performs preliminary action by forming grooves in the material layer before the photoresist removal step. These pre-formed grooves ensure that the removal solution can effectively access and remove photoresist patterns, guaranteeing complete removal and preventing electrical connectivity issues without compromising process efficiency.
3Adaptability or versatility
If wide signal lines and metal patterns are used, then the device functionality is improved, but photoresist patterns are difficult to remove completely
Solution Approach 1:
The patent introduces a vertical dimension by forming grooves that extend downward from the surface into the material layer. This dimensional approach creates pathways that allow the removal solution to access photoresist patterns from below, ensuring complete removal from wide signal lines and metal patterns while maintaining their functional dimensions.
Data Source
AI summary
A method of lifting off includes forming a first material layer on a substrate; forming a photoresist pattern including first and second holes and on the first material layer; patterning the first material layer using the photoresist pattern as a patterning mask to form a material pattern having first and second grooves within the material pattern, the first and second grooves corresponding to the first and second holes, respectively; forming a second material layer on an entire surface of the substrate including the photoresist pattern and the first and second grooves; and removing the photoresist pattern and the second material layer on the photoresist pattern at the same time, wherein a portion of the material pattern between the first and second grooves and portions of the material pattern at sides of the first and second grooves constitute a line as a whole.