LCD Light Source Wiring Patterns for Thermal Dissipation
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Solution Overview
Problem
Liquid crystal display devices face challenges in efficiently rejecting heat and maintaining image quality while reducing thickness and power consumption, especially as screen sizes diversify, due to limitations in heat release and light source control in both side-light and down-type backlight configurations.
Innovation Solution
The liquid crystal display device incorporates a light source unit with a light guide plate and a chassis, where plural light emitting elements are mounted on a wiring substrate with widened wiring patterns on both surfaces for thermal connection to the chassis, allowing efficient heat dissipation and flexible light control across the screen.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the liquid crystal display device is reduced excessively, then the external configuration becomes thinner, but it becomes difficult to form the air passage for rejecting heat generated inside the casing
Solution Approach 1:
The patent transitions from relying solely on air passages in the thickness direction to utilizing the planar width direction for heat dissipation. The heat dissipation fin structure extends in the width direction, allowing heat to be rejected laterally rather than requiring vertical air flow paths, thus enabling thin design while maintaining effective heat rejection.
Solution Approach 2:
The patent introduces a heat dissipation fin structure as an intermediary thermal management component. This fin structure acts as a heat transfer mediator between the light source unit and the external environment, efficiently conducting heat away from sensitive areas through its extended surface area without requiring thick air passages.
2Device complexity
If the side-light type backlight device concentrates light sources at end portions of the screen, then the structure can be more compact, but it becomes difficult to release the heat from the light source or control illuminance of the light source in accordance with the image signal
Solution Approach 1:
The patent segments the light source into multiple independent light emitting elements that can be individually controlled. This segmentation allows different regions of the screen to have independent illuminance control and heat management, enabling local dimming and improved heat release from each light source unit without requiring complex overall structural changes.
Solution Approach 2:
The patent introduces a heat dissipation fin structure as an intermediary thermal management component. This fin structure acts as a heat transfer mediator between the light source unit and the external environment, efficiently conducting heat away from sensitive areas through its extended surface area without requiring thick air passages.
3Illumination intensity
If the down type backlight device uses more light sources to illuminate the liquid crystal panel, then the illuminance can be improved, but the cost and power consumption increase
Solution Approach 1:
The patent implements dynamic control of light emitting elements through independent illuminance adjustment for different screen regions. This dynamic control allows the system to use only the necessary light output for each area, reducing overall power consumption while maintaining required illuminance levels, especially in areas where full brightness is not needed.
Solution Approach 2:
The patent applies local quality control by allowing different regions of the backlight device to have different illuminance levels. This enables the system to provide high illuminance only where needed while reducing or turning off lights in other areas, thereby reducing total power consumption while maintaining image quality.
4Illumination intensity
If the distance from the light source to the liquid crystal panel is increased to suppress uneven brightness, then the image quality can be improved, but the thickness of the liquid crystal display device increases
Solution Approach 1:
The patent segments the backlight into multiple independently controllable light source units. This segmentation allows precise local illuminance control, enabling the system to achieve uniform overall brightness by adjusting individual regions rather than requiring increased distance from all light sources to the panel.
Solution Approach 2:
The patent utilizes parameter changes by independently adjusting the illuminance parameters of different light emitting elements. This allows the system to optimize brightness uniformity across the screen by varying light output parameters locally, eliminating the need to increase the distance between light sources and the liquid crystal panel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat releasing performance, improves image quality, reduces power consumption, and lowers costs while enabling thinner designs, regardless of screen size, by effectively managing heat and illuminance through the light source units.
Implementation Method 1
The wiring patterns on both the upper and back surfaces of the wiring substrate, which is on a surface different from a light emitting element mount surface is thermally connected to the chassis
Data Source
AI summary
Each of plural light source units is formed by combining a light source formed of plural light emitting elements mounted on a wiring substrate with a light guide plate having a side surface serving as a light incident surface. The wiring substrate is attached to the chassis such that the light output surface of the light emitting element is perpendicular to the light emitting element mount surface of the wiring substrate. The wiring patterns each with the larger width than that of the electrode are formed on both upper and back surfaces of the substrate at the portion to which the power feeding electrode of the light emitting element is soldered. They are connected via the through holes which are arranged in plural rows around the electrode.