Active-Matrix LCD Line Cutting With an Etch-Stop Layer
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Solution Overview
Problem
In the manufacturing of active matrix driving mode liquid crystal devices, excess current due to electrostatic charges can damage scanning lines, leading to dielectric breakdown and display inconsistencies, particularly when using plasma CVD methods, as existing methods require excessive etching to cut short-circuit wiring lines, which can thin or crack underlying light-shielding films.
Innovation Solution
A method involving the formation of an etching stopping layer below the common line for short-circuiting scanning lines, which prevents excess current damage and allows for precise cutting of the common line without affecting underlying films, thereby stabilizing the manufacturing process and preventing display inconsistencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching is excessively performed to remove conductive film and resist in the cutting hole, then the short-circuit wiring line can be reliably cut, but the base insulating film may be thinned or etching may reach the lower light-shielding film causing cracks and display inconsistency
Solution Approach 1:
The patent forms a protective film in advance at the bottom of the cutting hole before etching the short-circuit wiring line. This preliminary action prevents excessive etching from reaching and damaging the base insulating film and lower light-shielding film, thereby protecting display quality while still enabling reliable cutting of the short-circuit wiring line.
2Measurement precision
If the aspect ratio of the cutting hole is made large to improve exposure accuracy, then the photolithography precision is improved, but the resist may remain in the cutting hole and the short-circuit wiring line may not be cut
Solution Approach 1:
The patent introduces a protective film as an intermediary substance at the bottom of the cutting hole. This protective film serves as a mediator that allows the etching process to proceed sufficiently to cut the short-circuit wiring line while preventing the etching from damaging underlying structures, thus resolving the conflict between achieving adequate etching depth and maintaining structural integrity.
3Reliability
If short-circuit wiring lines are formed to disperse electrostatic charges, then the scanning lines are protected from damage, but the common line must be cut after TFT formation requiring complex multi-step processes
Solution Approach 1:
The patent merges the formation of the protective film with the existing manufacturing process by forming it simultaneously with the gate insulating film. This integration reduces the total number of separate process steps required while maintaining both the electrostatic protection function and the cutting reliability, thereby reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures reliable cutting of short-circuit wiring lines without damaging the light-shielding film, maintaining high-quality display consistency and simplifying the manufacturing process by preventing cracks and light leakage.
Implementation Method 1
forming a cutting hole in the first interlayer insulating film by etching so as to cut the common line
Data Source
AI summary
A method of manufacturing an electro-optical device, which, on a substrate, has a plurality of data lines, a plurality of scanning lines, a plurality of driving elements formed to correspond to intersections of the plurality of data lines and the plurality of scanning lines for pixels, and a plurality of pixel electrodes provided to correspond to the driving elements, includes forming an etching stopping layer, forming a common line that is provided above the etching stopping layer to short-circuit the plurality of scanning lines and the plurality of scanning lines, forming a first interlayer insulating film that isolates the plurality of data lines and the plurality of pixel electrodes from the plurality of scanning lines and the plurality of driving elements, forming contact holes that electrically connect the plurality of data lines and the plurality of pixel electrodes to the plurality of driving elements, forming the plurality of data lines, and forming a cutting hole in the first interlayer insulating film by etching so as to cut the common line.