LCD Pad Bump Structure for Driver IC Adhesion
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Solution Overview
Problem
The attachment of low-temperature poly-silicon Driver Integrated Circuit (DIC) substrates to liquid crystal panels results in poor pad uniformity and weak adhesiveness.
Innovation Solution
A pad structure for liquid crystal displays is developed, featuring bumps formed on the IC substrate made of photo-acryl, which are electrically connected to transparent electrodes and a conductive ball, allowing for adjustable thickness and enhanced bonding between the IC substrate and the liquid crystal panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If low-temperature poly-silicon Driver Integrated Circuit substrates are attached to liquid crystal panels, then driver IC integration is achieved, but pad uniformity deteriorates and adhesiveness weakens
Solution Approach 1:
The invention introduces a multi-layer pad structure with different materials (conductive material layer, insulating material layer, and optional bump layer) to create local quality variations. The bump layer with adjustable height provides localized pressure distribution, while the insulating layer prevents short circuits, collectively improving pad uniformity without compromising driver IC integration
Solution Approach 2:
The pad structure employs composite materials including conductive materials (such as aluminum or copper), insulating materials (such as silicon oxide or silicon nitride), and bump materials (such as photo-acryl or metal). This composite approach enables simultaneous achievement of electrical conductivity, electrical isolation, and mechanical pressure control, resolving the pad uniformity issue while maintaining driver IC functionality
2Adaptability or versatility
If low-temperature poly-silicon Driver Integrated Circuit substrates are attached to liquid crystal panels, then driver IC integration is achieved, but adhesiveness between pad and panel deteriorates
Solution Approach 1:
The bump layer is formed in advance on the pad structure before the bonding process. This preliminary action creates pre-defined pressure distribution zones that enhance adhesion during the subsequent bonding process, ensuring strong adhesiveness between the driver IC substrate and liquid crystal panel while maintaining integration capability
Solution Approach 2:
The height of the bump layer is controllable within a specific range (0.1-10 μm), allowing parameter adjustment to optimize both adhesion strength and electrical contact. By changing the bump height parameter, the system achieves enhanced adhesiveness without compromising driver IC integration
Data Source
AI summary
A pad of a liquid crystal display and a method for manufacturing the same are disclosed. The pad of the liquid crystal display includes an IC substrate and a lower substrate opposite each other, an IC pad metal formed on the IC substrate, a bump formed on the IC substrate to come into contact with the IC pad metal, a first transparent electrode electrically connected with the IC pad metal, an interlayer insulating layer formed between the IC pad metal and the first transparent electrode, a gate pad metal formed on the lower substrate, a second transparent electrode electrically connected with the gate pad metal, a gate insulating layer formed between the gate pad metal and the second transparent electrode, and a conductive ball to electrically connect the first transparent electrode and the second transparent electrode to each other.