LCD Panel Cutting via Multi-Head Scribing and Steam Cracking

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Solution Overview

Problem

The existing methods for cutting liquid crystal display panels from large-scale mother substrates are time-consuming and generate glass chips, which can degrade the quality of the LCD devices and pose health risks, while also requiring extensive standby times that reduce productivity.

Innovation Solution

A method involving the use of a scribing unit with multiple heads to form prearranged cut lines on both surfaces of the mother substrates in multiple directions, followed by steam cracking along these lines to separate the panels, thereby reducing cutting time and preventing glass chip generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional cutting methods with single wheel are used, then the cutting process is simple, but the cutting time is long and productivity is low

Engineering Contradiction:
Improvecutting speedVSAvoidcutting device structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The cutting device is segmented into multiple independent cutting wheels (at least two wheels) that can simultaneously or sequentially cut along different directions. This segmentation allows parallel cutting operations, significantly reducing the total cutting time while maintaining manageable device complexity through modular wheel assemblies.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cutting process transitions from single-direction sequential cutting to multi-directional simultaneous cutting by introducing cutting wheels that operate in different spatial dimensions. This dimensional expansion enables multiple cut lines to be formed concurrently, doubling or tripling the cutting speed without proportionally increasing device complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If extensive standby time is provided for cracking, then the cracking process is stable, but productivity decreases

Engineering Contradiction:
Improvecracking stabilityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

Prearranged cut lines are formed on the mother substrate before the cracking process. These prearranged lines serve as guides that ensure cracks propagate along the intended paths, eliminating the need for extensive standby time while maintaining cracking stability. The preliminary structuring of the substrate enables rapid, controlled cracking.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The traditional mechanical waiting period for crack propagation is replaced by a controlled chemical or thermal process that initiates cracking along prearranged lines. This substitution eliminates the need for prolonged standby time while ensuring stable, predictable crack patterns, thereby improving productivity without sacrificing reliability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If traditional cutting methods are used, then the process is straightforward, but glass chips are generated affecting quality and safety

Engineering Contradiction:
Improvecutting process simplicityVSAvoidglass chip generation
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

An intermediary substance or process is introduced between the cutting wheel and the substrate to prevent direct mechanical impact that generates glass chips. This intermediary layer absorbs the cutting stress and guides it along the prearranged lines, eliminating chip generation while maintaining process simplicity. The intermediary acts as a buffer that protects both the substrate quality and operator safety.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The cutting parameters are changed from high-impact mechanical cutting to controlled low-impact cutting along prearranged lines. By modifying the cutting mechanism to follow predetermined paths with controlled force application, glass chip generation is eliminated while the process remains simple and straightforward to implement.

Inventive Principle:
Principle #35Parameter changes

4Manufacturing precision

If multiple scribing units with multiple heads are used, then cutting precision and productivity improve, but device complexity increases

Engineering Contradiction:
Improvecut line accuracyVSAvoidscribing unit structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The scribing system is segmented into multiple independent heads, each capable of forming cut lines along specific directions. This segmentation allows precise control of each head's positioning and movement, ensuring high cutting precision while managing device complexity through modular, standardized head units that can be independently calibrated and maintained.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly shortens the cutting time, stabilizes the cracking process, and prevents glass chip formation, enhancing the quality and safety of the LCD devices while improving productivity.

Implementation Method 1

forming first prearranged cut lines for sectioning the panel regions in a first direction on front and rear surfaces of the mother substrates through a first scribing unit having a plurality pairs of first heads; forming second prearranged cut lines for sectioning the panel regions in a second direction on the front and rear surfaces of the mother substrates through a second scribing unit having a plurality pairs of second heads

Methodology Applied
Scientific EffectMechanical scratching/etching: Abrasion

Implementation Method 2

spraying steam on the front and rear surfaces of the mother substrates to make crack along the first and second prearranged cut lines in order to separate the liquid crystal display panels

Methodology Applied
Scientific EffectThermal stress cracking: Thermal Shock

Data Source

PatentUS7460205B2Method for cutting liquid crystal display panel and method for fabricating liquid crystal display panel using the same
Publication Date: 2008.12.02 LG DISPLAY CO LTD
  • US7460205B2 patent drawing
  • US7460205B2 patent drawing
  • US7460205B2 patent drawing

AI summary

A method for cutting a liquid crystal display panel includes transferring a pair of attached mother substrates having a plurality of panel regions arranged thereon to a first scribing part; forming first prearranged cut lines for sectioning the panel regions in a first direction on front and rear surfaces of the mother substrates through a first scribing unit having a plurality pairs of first heads; forming second prearranged cut lines for sectioning the panel regions in a second direction on the front and rear surfaces of the mother substrates through a second scribing unit having a plurality pairs of second heads; and transferring the mother substrates with the first and second prearranged first and second cut lines formed thereon to a breaking part and separating them into a plurality of unit liquid crystal display panels.