Liquid Crystal Display Panel Cutting via Thermal Expansion

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Solution Overview

Problem

The existing methods for cutting liquid crystal display panels from large-scale mother substrates are time-consuming and prone to damage, with the breaking process generating glass chips and requiring multiple passes, which reduces productivity and increases the risk of panel damage.

Innovation Solution

A method involving a transfer unit with a body to adsorb and transfer the panel and a plate to separate dummy glass, forming prearranged cut lines on both surfaces of the substrates, and using steam to crack along these lines, allowing for efficient separation without rotating the substrates and minimizing damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a prearranged cut groove is formed with a high hardness wheel and cracking is made along the groove, then the liquid crystal display panels can be separated from the mother substrate, but the breaking process generates glass chips and requires multiple passes which reduces productivity

Engineering Contradiction:
Improvecutting speedVSAvoidglass chips
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the traditional mechanical breaking method (using high hardness wheels to create cut grooves and apply mechanical force to crack the substrate) with a thermal field method. A line heat source moves along the mother substrate to heat the attached substrates, causing thermal expansion and automatic separation along predetermined lines without mechanical contact or grooving. This eliminates glass chip generation and reduces the process to a single pass, directly resolving the contradiction between productivity and harmful factors.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If the attached mother substrates are cut using traditional breaking methods, then separation is achieved, but the process is time-consuming and increases the risk of panel damage

Engineering Contradiction:
Improvepanel integrityVSAvoidcutting time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces mechanical breaking operations with a thermal field method where a line heat source heats the attached substrates along predetermined cutting lines. The thermal expansion causes automatic separation without mechanical stress or contact, eliminating the risk of panel damage while reducing cutting time to a single continuous pass operation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent applies thermal energy along predetermined cutting lines before any separation occurs. The line heat source follows predetermined trajectories that define where separation should occur, preparing the thermal path in advance and ensuring clean separation without the need for multiple passes or mechanical grooving operations.

Inventive Principle:
Principle #10Preliminary action

3Productivity

If multiple passing is performed to cut the mother substrates, then complete separation is achieved, but productivity is reduced and the risk of damage increases

Engineering Contradiction:
Improvecutting efficiencyVSAvoidpanel safety
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent replaces multiple mechanical breaking passes with a single thermal field pass. The line heat source continuously moves along predetermined cutting lines, heating and separating the substrates in one continuous operation. This single-pass thermal method achieves complete separation without the need for repeated mechanical operations, simultaneously improving productivity and panel safety.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method significantly reduces the time required for cutting and prevents dummy glass from being dropped, thereby enhancing productivity and ensuring the integrity of the liquid crystal display panels during extraction.

Implementation Method 1

a line heat source is moved along a mother substrate in a predetermined manner to heat the attached substrates

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

a transfer unit, which includes a body for adsorbing a liquid crystal display panel and transferring the panel

Methodology Applied
Scientific EffectAdsorption: Adsorption

Data Source

PatentUS7714978B2Method for cutting liquid crystal display panel and method for fabricating liquid crystal display panel using the same
Publication Date: 2010.05.11 LG PHILIPS LCD CO LTD
  • US7714978B2 patent drawing
  • US7714978B2 patent drawing
  • US7714978B2 patent drawing

AI summary

A method for cutting a liquid crystal display panel including: forming prearranged cut lines on a pair of attached mother substrates on which a plurality of panel regions have been disposed; and separating the liquid crystal display panel from a dummy glass around the liquid crystal display panel through a transfer unit which includes a body for adsorbing a liquid crystal display panel and transferring it, and a plate attached on an edge of the body, fixing and separating a dummy glass of a mother substrate from the liquid crystal display panel, and moving up and down separately from the body. A dummy removing plate is attached at an edge of a trans hand to remove a dummy glass when a breaking process-finished liquid crystal display panel is extracted, so a damage of the liquid crystal display panel due to the dummy glass can be prevented.