Liquid Crystal Panel End-Face Bonding for Narrow Bezel
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional liquid crystal display technologies face challenges in achieving ultra-narrow or bezel-less designs due to the longer bonding region extending from the TFT substrate, which requires additional bezels to cover the connection lines, affecting the appearance and aesthetics of the display.
Innovation Solution
A liquid crystal panel design where the chip on film is bonded to the end face of the array substrate, electrically connected to the metal line array, and the other end is bonded to the circuit board, allowing for a flush or protruding configuration that avoids the longer bonding region, enabling ultra-narrow bezel or bezel-less displays by using conductive adhesive layers and conductive dots for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the TFT substrate is made larger to expose the bonding position of the driving circuit, then the bonding position can be reserved, but an outer bezel is needed to cover the bonding region, affecting the appearance and preventing ultra-narrow bezel or bezel-less display
Solution Approach 1:
The patent transitions from conventional planar bonding to three-dimensional end-face bonding. The chip on film is bonded to the end face of the array substrate, utilizing the vertical dimension to route connection lines. This dimensional change allows the bonding region to be positioned at the edge of the display panel rather than extending across the front surface, eliminating the need for a wide outer bezel and enabling ultra-narrow or bezel-less display designs.
2Object-affected harmful factors
If an outer bezel is disposed to cover the bonding region, then the connection lines are hidden, but the product appearance becomes less beautiful and ultra-narrow bezel cannot be achieved
Solution Approach 1:
The patent extracts the bonding region from the front view of the display panel by positioning it at the end face. The chip on film is bonded to the end face of the array substrate, and the connection lines are routed through the side edge rather than across the front surface. This extraction eliminates the need for a wide outer bezel to cover the bonding region, as the bonding area is now positioned at the periphery where it does not interfere with the display area or require aesthetic concealment.
3Shape
If the chip on film is bonded to the end face of the array substrate, then ultra-narrow bezel or bezel-less display is enabled, but electrical connectivity must be established through end face bonding
Solution Approach 1:
The patent introduces a conductive adhesive layer as an intermediary between the chip on film and the array substrate end face. This conductive adhesive layer facilitates both mechanical bonding and electrical connectivity simultaneously. The connection lines on the array substrate are electrically connected to the chip on film through this conductive adhesive layer, enabling end-face bonding to achieve both structural attachment and electrical signal transmission functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the realization of ultra-narrow bezel or bezel-less displays by ensuring electrical connectivity without the need for additional bezels, enhancing the aesthetic appeal and design flexibility of liquid crystal display panels.
Implementation Method 1
a conductive adhesive layer is adhered between the end face of the array substrate and the chip on film, the conductive adhesive layer is electrically connected to the metal line array
Implementation Method 2
conductive dots are formed on the end faces of the array substrate and the frame glue, the metal line array is led out to be electrically connected to the conductive dots
Data Source
AI summary
The present invention discloses a liquid crystal panel, includes a color filter substrate, an array substrate, a liquid crystal disposed between the color filter substrate and the array substrate, a chip on film, a driver chip and a circuit board disposed on the chip on film, one end of the chip on film is bonded to an end face of the array substrate and is electrically connected with a metal line array in the array substrate, the other end of the chip on film is bound with the circuit board. The invention also discloses a method for fabricating a liquid crystal panel and a display apparatus. When applying signal to the liquid crystal panel, the chip on film is bonded to the end face of the array substrate to realize the conduction of the metal line array avoiding the longer bonding region extended from a side of the TFT substrate.