Liquid Crystal Panel Repair Lines for Driving Chip Connection Failures
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Solution Overview
Problem
Existing methods for repairing open failures in liquid crystal panels cannot address open failures at the connection position of the driving chip assembly, leading to the panel being treated as a waste product.
Innovation Solution
A liquid crystal panel design that includes a driving chip assembly with a chip repair line and an array substrate with an array substrate repair line, both initially overlapped but insulated, allowing for electrical connection between the chip and array substrate repair lines and lead wirings, enabling repair of open failures at the connection position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If traditional repair methods are used for open failures in liquid crystal panels, then pixel area open failures can be repaired, but connection position open failures of the driving chip assembly cannot be repaired
Solution Approach 1:
The invention divides the repair system into two independent but corresponding segments: chip repair lines on the driving chip assembly and array substrate repair lines on the array substrate. Each segment can be independently configured and connected, allowing the repair system to adapt to different failure positions without requiring a complete redesign of the repair approach.
Solution Approach 2:
The invention introduces repair lines as intermediary conductive paths that bridge the chip lead wirings and array substrate lead wirings. These intermediary repair lines provide alternative current paths when original connection paths fail, enabling repair of connection position open failures that traditional direct welding methods cannot address.
2Ease of repair
If repair lines are added to enable repair of connection position open failures, then repair capability is improved, but device complexity increases
Solution Approach 1:
The invention merges the chip repair lines and array substrate repair lines into a coordinated system where corresponding repair lines from both substrates work together as a unified repair path. This merging allows the repair system to function as a integrated whole, reducing the need for multiple independent repair mechanisms and thereby controlling overall device complexity.
Solution Approach 2:
The repair lines are designed with multi-functionality to serve various repair needs. The same repair line structure can address different types of open failures (chip lead wiring disconnections, array substrate lead wiring disconnections, or connection position failures) by configuring appropriate welding points, thereby reducing the need for specialized repair components for each failure type.
3Ease of repair
If repair lines are overlapped with lead wirings to enable welding repairs, then ease of repair is improved, but insulation reliability may be compromised
Solution Approach 1:
The invention implements preliminary insulation measures by pre-forming insulation layers between the repair lines and lead wirings before the welding process. This preliminary action ensures that insulation is already in place when repair welding is performed, allowing easy welding accessibility while maintaining insulation reliability without requiring post-welding insulation repairs.
Data Source
AI summary
An embodiment of the invention provide a liquid crystal panel comprising a driving chip assembly comprising: a chip lead wiring and a chip repair line, which are overlapped but insulated from each other; an array substrate comprising an array substrate lead wiring and an array substrate repair line, which are overlapped but insulated from each other; wherein the driving chip assembly is mounted on the array substrate which is electrically connected with the corresponding chip lead wiring connection, and the two ends of the chip repair line is electrically connected with the corresponding two ends of the array substrate repair line respectively.