Liquid Crystal Panel Motherboard Slicing Protection
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Solution Overview
Problem
During the slicing process of liquid crystal panel motherboards, the metallic terminal parts of the TFT substrate are easily scraped by the CF substrate, leading to malfunction due to the structural design where the lower support platform is lower than the upper support platform, causing friction and damage.
Innovation Solution
A soft protective film made of polystyrene (PS) or polyethylene (PE) with a thickness between 1 and 4 um is applied to the contact area where the CF substrate touches the metallic terminal parts of the TFT substrate, acting as a buffer to prevent scraping and damage during slicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the lower support platform is positioned lower than the upper support platform during slicing, then the slicing process can be completed, but the TFT substrate easily rubs the CF substrate causing metallic terminal parts to be scraped
Solution Approach 1:
A protective film is introduced as an intermediary layer between the TFT substrate and CF substrate. This film prevents direct contact and friction between the two substrates during the slicing process, thereby protecting the metallic terminal parts from being scraped while allowing the slicing operation to proceed normally
Solution Approach 2:
The protective film is applied in advance to the TFT substrate before the slicing process begins. This pre-application creates a cushioning layer that absorbs friction and prevents damage during the subsequent slicing operation, ensuring the metallic terminal parts remain intact
2Device complexity
If the TFT substrate and CF substrate are in direct contact during slicing, then the structure is simple, but the metallic terminal parts are easily scraped causing malfunction
Solution Approach 1:
The protective film serves as a mediator between the TFT substrate and CF substrate, eliminating direct harmful contact. This adds minimal complexity to the structure while effectively preventing friction-induced scraping of the metallic terminal parts
Solution Approach 2:
A thin protective film is applied to the TFT substrate to create a flexible protective layer. This thin film structure maintains simplicity while providing sufficient protection against friction and scraping during the slicing process
Data Source
AI summary
A liquid crystal panel motherboard need slicing is proposed. The liquid crystal panel motherboard includes a main substrate disposed at one side of a CF (2) and a main substrate disposed at one side of a TFT (1). The liquid crystal panel motherboard can be sliced to be at least two liquid crystal panels including a CF substrate (20) and a TFT substrate (10). Metallic terminal parts are formed on each TFT substrate (10). A soft protective film (24) is disposed on a touching area (22) connected to each metallic terminal part of the TFT substrate (10) connected to the CF substrate (20). The soft protective film (24) has a certain thickness and leans against its corresponding metallic terminal part on a main substrate at the side of the TFT (1). A manufacturing method of the liquid crystal panel motherboard needing slicing is also proposed. The present invention has an advantage of preventing the metallic terminal part of the TFT substrate from being scraped when the liquid crystal panel motherboard is sliced, thereby improving the production yield rate.