LCD Heat Dissipation via PCB Separation Gap
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Solution Overview
Problem
Existing LCD devices degrade due to heat from the power supply unit affecting the liquid crystal layer and polarization plates, with inefficient heat dissipation and manual attachment of conductive tapes leading to defects.
Innovation Solution
A separation part is created between the printed circuit board and the main support to dissipate heat, preventing direct heat transfer to the LCD module and allowing efficient heat dissipation outside the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the printed circuit board is attached directly to the main support, then the device structure is simple and easy to manufacture, but heat from the power supply unit directly affects the liquid crystal layer and polarization plates causing degradation
Solution Approach 1:
The patent introduces a separation part that divides the contact area between the printed circuit board and main support, creating distinct regions: a first contact area for electrical connection and a second contact area separated by the separation part. This segmentation prevents heat transfer while maintaining structural integrity and electrical functionality.
Solution Approach 2:
The separation part acts as an intermediary element between the printed circuit board and main support. It mediates the thermal interaction by blocking heat transfer paths while allowing the structural and electrical functions to continue, thus protecting the liquid crystal layer and polarization plates from thermal degradation.
2Temperature
If conductive tapes are used for heat dissipation, then heat transfer capability is improved, but manual attachment causes defects and reduces manufacturing precision
Solution Approach 1:
The patent replaces the manual mechanical attachment method (conductive tapes requiring manual placement) with an integrated structural design where the separation part is formed as part of the main support structure. This substitution eliminates manual operations and associated defects while maintaining effective heat dissipation through the separated contact areas.
3Temperature
If the printed circuit board is separated from the main support, then heat dissipation is improved, but the attachment structure becomes more complex
Solution Approach 1:
The patent merges the separation part with the main support structure, making them integral to each other. This combination achieves heat dissipation through separation while avoiding the complexity of additional independent attachment components, as the separation part and main support form a unified structural entity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The separation part effectively prevents degradation of the liquid crystal layer and polarization plates by dissipating heat away from the LCD module, improving the reliability of heat management in LCD devices.
Implementation Method 1
a separation part arranged between the printed circuit board and the main support and creating a gap therebetween to dissipate heat from the printed circuit board
Data Source
AI summary
A liquid crystal display device includes a main support supporting a liquid crystal panel and a back light unit, a printed circuit board attached to the liquid crystal panel to provide driving signals to the liquid crystal panel, a separation part between the printed circuit board and the main support creating a gap therebetween, and a holder holding the printed circuit board and the main support together.