Plasma Ashing for LCD Counter Electrode Adhesion
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Solution Overview
Problem
In liquid crystal display devices, the low-temperature CVD process used to form the interlayer insulating film reduces its adhesiveness to the counter electrode, leading to peeling issues during the rubbing process, which contaminates the manufacturing and reduces yield.
Innovation Solution
Plasma ashing is performed on the counter electrode and organic passivation film before forming the interlayer insulating film by low-temperature CVD, creating overhangs that increase the contact area and adhesiveness between the counter electrode and interlayer insulating film, preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If low-temperature CVD is used to form the interlayer insulating film, then the organic passivation film characteristics are preserved, but the adhesiveness of the interlayer insulating film to the counter electrode is reduced
Solution Approach 1:
The patent applies preliminary action by performing plasma treatment on the counter electrode before forming the interlayer insulating film. This preliminary plasma treatment modifies the surface of the counter electrode to enhance subsequent adhesion, allowing the interlayer insulating film to adhere properly even when formed at low temperatures that preserve the organic passivation film characteristics.
2Reliability
If the interlayer insulating film is formed by low-temperature CVD, then the organic passivation film is not damaged, but peeling occurs during the rubbing process
Solution Approach 1:
The plasma treatment is performed as a preliminary action before forming the interlayer insulating film. This treatment creates a surface that promotes strong adhesion, preventing peeling during subsequent rubbing processes while maintaining the low-temperature formation that protects the organic passivation film.
Solution Approach 2:
The patent changes the surface parameters of the counter electrode through plasma treatment, modifying its surface energy and roughness to enhance adhesion. This parameter change allows the interlayer insulating film to maintain stability and resist peeling without requiring high-temperature formation that would damage the organic passivation film.
3Productivity
If the interlayer insulating film peels from the counter electrode, then manufacturing yield is reduced and the rubbing process is contaminated
Solution Approach 1:
The patent applies preliminary anti-action by performing plasma treatment to prevent the harmful effect of peeling before it occurs. This preventive measure addresses the root cause of contamination and yield loss by ensuring strong adhesion between the interlayer insulating film and counter electrode, thereby eliminating peeling-related contamination and improving manufacturing yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the adhesiveness between the counter electrode and interlayer insulating film, preventing peeling and contamination, thereby increasing the manufacturing yield of liquid crystal display devices.
Implementation Method 1
Plasma ashing is performed on the counter electrode and organic passivation film before forming the interlayer insulating film by low-temperature CVD
Implementation Method 2
forming an interlayer insulating film by low-temperature CVD
Data Source
AI summary
A flat, solid counter electrode is formed on an organic passivation film. Before forming an interlayer insulating film on the counter electrode, plasma ashing is performed. A surface of the organic passivation film is trimmed by the plasma ashing, forming an overhang. The plasma ashing not only trims a surface of the organic passivation film but also roughens a surface of the counter electrode. This increases a contact area between the interlayer insulating film and the organic passivation film or counter electrode, increasing the adhesiveness therebetween. Further, the plasma ashing eliminates the remainder of a resist on the counter electrode, increasing the adhesiveness of the interlayer insulating film.