Liquid Crystal Display Reflective Layer Bump Formation
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Solution Overview
Problem
Conventional liquid crystal display devices face challenges in achieving high light scattering characteristics and efficient production processes, particularly in forming minute ruggedness on reflective layers, which affects image quality and production efficiency.
Innovation Solution
A production method involving a metal layer with apertures, a semiconductor layer, and a protection layer, where photolithography is used to pattern the protection layer and form bumps on the reflective layer, allowing for the creation of narrow-width protrusions that enhance light diffusing characteristics and viewing angle efficiency without additional polishing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polishing the glass substrate surface with polish powder is used to obtain a coarse face, then light scattering characteristics are improved, but a separate polishing step is required which reduces production efficiency
Solution Approach 1:
The patent merges the formation of the reflective layer with the formation of ruggednesses on the same layer. The bumps are formed on the reflective layer during the TFT manufacturing process, combining multiple functions into a single step and eliminating the need for separate polishing steps, thereby maintaining high production efficiency while achieving improved light scattering characteristics.
2Manufacturing precision
If polishing the glass substrate surface is used to form ruggednesses, then light scattering characteristics are improved, but impurities such as swarf may be left in the device which deteriorates the quality of the liquid crystal display device
Solution Approach 1:
The patent replaces the mechanical polishing process with a method that forms bumps on the reflective layer through a different mechanism during TFT manufacturing. This substitution eliminates the generation of swarf and other impurities that are inherent in mechanical polishing processes, thereby preventing quality deterioration while still achieving the desired light scattering characteristics.
3Manufacturing precision
If a non-flat reflection surface is formed on the reflective layer, then displayed image contrast is improved, but the process becomes more complex
Solution Approach 1:
The patent merges the formation of the reflective layer with the formation of bumps that create the non-flat surface. By forming both the reflective layer and the ruggednesses in the same manufacturing step during TFT production, the process complexity is minimized while still achieving the contrast improvement benefits of a non-flat reflection surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of a liquid crystal display device with high light diffusing characteristics and improved reflection efficiency, achieving better viewing angle characteristics and maintaining high production efficiency at a low cost.
Implementation Method 1
a photolithography step of irradiating the resist layer with light through the metal layer to pattern the protection layer by photolithography technique
Implementation Method 2
allow incident light entering the display device to be more uniformly and efficiently reflected by the reflection surface across the entire display surface, without causing specular reflection in one direction
Data Source
AI summary
A production method for a liquid crystal display device having a plurality of thin film transistors (TFTs) including reflection sections disposed to correspond to a plurality of pixels includes: a step of forming on a substrate a metal layer having apertures; a step of forming a semiconductor layer on the metal layer; a step of forming a protection layer on the semiconductor layer; a step of forming a resist layer on the protection layer; a photolithography step of irradiating the resist layer with light through the metal layer to pattern the protection layer by photolithography technique; and a step of stacking a reflective layer on the patterned protection layer. A plurality of bumps are formed from the protection layer in the photolithography step, and a plurality of bumps corresponding to the plurality of bumps of the protection layer are formed on the reflective layer.